Circuit boards and methods for their manufacture are disclosed. The circuit boards carry high-speed signals using conductors formed to include lengthwise channels. The channels increase the surface area of the conductors and therefore enhance the ability of the conductors to carry high-speed signals. In at least some embodiments, a discontinuity also exists between the dielectric constant within the channels and just outside the channels, which is believed to reduce signal loss into the dielectric material.
Patent No.: US 8,168,891 BI
Date of Patent: May 1, 2012
Filed: May 2, 2008
Int. Cl.: H05K 1/00 (2006.01)
U.S. Cl.: 174/258; 174/255
U.S. Cl.: 375/260; 375/259
CPC Cl.: H01P 3/081 (20130101); H05K 1/0245 (20130101); H05K 1/024 (20130101); H05K 1/0216 (20130101); H05K 1/0298 (20130101); H05K 3/0091 (20130101); H05K 3/46 (20130101); H05K 1/0242 (20130101); Y10T 29/49156 (20150115); H05K 2201/09236 (20130101); H05K 2201/09745 (20130101); H05K 2201/098 (20130101); B32B 2457/08 (20130101); B32B 2309/08 (20130101); B32B 2305/076 (20130101); H05K 2201/0187 (20130101); H05K 3/4611 (20130101); H05K 1/0366 (20130101); H05K 2201/029 (20130101); Y10T 29/49165 (20150115); Y10T 29/49126 (20150115); Y10T 29/49117 (20150115); Y10T 29/49128 (20150115)
Field of Search: 174/255,261,262,258; 361/777,780,794,78
