针对航空发动机、重型燃气轮机等动力设备燃烧室内压力原位测量的需求,设计了一种基于4H-SiC的LC谐振式无线高温压力敏感芯片.以现有SiC微工艺; 水平为基础,利用TCAD软件及多物理场耦合仿真软件,完成了敏感芯片电容、电感、感压膜等主要部件的结构设计、优化,以提高敏感芯片的Q值及耦合强度.; 探讨了电感内置、外置两种设计方案本体电容的大小,并在此基础上提出一种双腔体结构,将本体电容值减小到179. 66; pF.优化后的敏感芯片常温(20 ℃)Q值约为13. 66,100 kPa满量谐振频率变化158. 62 kHz; 1 000 ℃下的Q值为3.; 65,满量变化55. 53 kHz,且1 000; ℃下的热应力较小.这种敏感芯片将可应用于高温压力传感器的制备,为我国自主研制航空发动机、高超发动机、重型燃气轮机等先进动力系统提供支撑.To meet the demand of the in-situ pressure measurement in combustion; chambers of heavy gas turbines and aero-engine,4H-SiC based and LC; resonant wireless passive pressure sensitive chips were designed. To; improve the Q value and couple coefficient,geometric parameters of chips; primary structures, such as the capacitance,inductance,vacuum cavity and; diaphragm,were optimized by numerical analysis with TCAD and; multi-physic field coupled-simulation softwares. Inductors relative; position,out of or inside the vacuum cavity was discussed,based on which; a dual-cavity chip design was proposed,reducing the bulk capacitance to; 179. 66 pF. Q value of sensitve chips fabricated with optimized; structure paramters was 13. 66 and 3. 65 at 20 ℃ and 1 000; ℃,respectively. The variation of the resonance frequency under full; scale 100 kPa was 158. 62 kHz at 20 ℃,which reduced to 55. 53 kHz when; the temperature rose to 1 000 ℃. These optimized chips could be applied; to prepare pressure sensors for harsh environment applications,which; would support the independent development of aero-engines,hypersonic; engines and heavy gas turbines.总装预先研究资助项
