Study on Lead-Free SAC305 Solder with different Particle Sizes generated with Laser Ablation Method

Abstract

The demand for lightweight and high functionality devices is always a driving force in development of smaller, lighter and compact electronics circuit. However, as components shrink, the connection points between them and printed circuit boards (PCBs) will be narrowed as well. A smaller solder particle is required to cope with this trend of miniaturization. In our study, a standard Type-4 solder were used as our sample target to produce solder with smaller particle size. A 266nm UV Laser source was utilized to carry out the laser ablation process. The particles generated from the UV Laser with different laser energy were collected. To study the effect of different energy used, the size of the particles was characterized with Nanoparticle Sizer, followed by DSC to determine the changes in melting point