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Thin channel β-Ga2O3 MOSFETs with self-aligned refractory metal gates
Authors
Andrew J. Green
Eric R. Heller
+8 more
Nolan S. Hendricks
Kevin D. Leedy
Kyle J. Liddy
Miles T. Lindquist
Neil A. Moser
Andreas Popp
Stephen E. Tetlak
Günter Wagner
Publication date
1 January 2019
Publisher
Bristol : IOP Publ.
Doi
Cite
Abstract
We report the first demonstration of self-aligned gate (SAG) β-Ga2O3 metal-oxide-semiconductor field-effect transistors (MOSFETs) as a path toward eliminating source access resistance for low-loss power applications. The SAG process is implemented with a subtractively defined and etched refractory metal, such as Tungsten, combined with ion-implantation. We report experimental and modeled DC performance of a representative SAG device that achieved a maximum transconductance of 35 mS mm-1 and an on-resistance of ∼30 Ω mm with a 2.5 μm gate length. These results highlight the advantage of implant technology for SAG β-Ga2O3 MOSFETs enabling future power switching and RF devices with low parasitic resistance. © Not subject to copyright in the USA. Contribution of Wright-Patterson AFB
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Last time updated on 23/07/2022