In the present work, the influence of the concentration of bitartrate ions (HT) on the copper electrodeposition process was analyzed. The study was carried out from an aqueous solution containing 0.001 M of CuX (where X = (NO3–)2 ,(Cl–)2, SO42–) and x M KHT (where x = 0.005 M, 0.01 M, and 0.015 M). From voltammetric and chronoamperometric studies, the results indicate that copper electrodeposition is a diffusion-controlled process. The current density transients were well described through a kinetic mechanism involving capacitive and faradaic contributions. The diffusion coefficient values of Cu1+ and Cu2+ result to be similar at the different concentration values of potassium bitartrate used in this work.
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