Research Based on Cohesive Zone Model for Interface Delamination of Waste Plastic Chip

Abstract

Abstract. The interface delamination of waste plastic chip will seriously affect the value of their recycling reuse; therefore, it has been a hot issue in recycling researches of Waste Electrical and Electronic Equipment (WEEE). Based on the exponential cohesion theory, this paper has researched chip delamination and established the Cohesive Zone Model (CZM) of delamination crack for chip interface, as well as proposed a method which combined the experiment of crack surface observation and the simulation of fracture mechanics. By employing this method, the CZM parameters of waste plastic chip interface have been obtained. Based on the CZM, the simulation of waste plastic chip interface delamination has been made, and its results showed that: temperature and humidity factors have a significant impact on the chip delamination. At last, the disassembly experiments of Waste Printed Circuit Boards (WPCB) have been made under different disassembly technology, and the delamination rate of resulting chips has been calculated. Then this paper has analyzed the influence rule of different disassembly conditions on the chip delamination and verified the correctness of chip delamination simulation results, as well as proposed an optimized disassembly technology of WPCB for reducing plastic chip’s delamination