Ni 30 Ti 50 Pt 20 High Temperature Shape Memory Alloy (HTSMA) Wires: Processing Related Issues

Abstract

Abstract There is a growing demand for high temperature shape memory alloys (HTSMAs) for applications in areas such as aeroengines, chemical industries, and nuclear power plants, where the ambient temperature is relatively high (150-350°C). Platinum addition to binary NiTi, with Pt substituting for Ni, has been found to raise the transformation temperatures of the alloy with the advantage of retaining the transformation hysteresis in the range 25-35°C. In the present study, a NiTiPt alloy was selected for processing into the wire form for applications in the range 200-250°C. Addition of Pt of about 20 at.% to binary NiTi was required to raise the transformation temperatures of the alloy above 200°C. It was found that Pt addition significantly changed the processing characteristics of the NiTiPt alloy from those of binary NiTi alloys. For successful processing of the NiTiPt wires, it was necessary to modify the process usually followed for binary NiTi alloys. Also, additional steps were incorporated to overcome the problems inherent to this alloy system. Some of these aspects related to processing of this alloy in wire form are discussed in this paper

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