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Advanced Copper Interconnects Application as an Adhesion-Enhancing Layer for Chemical Vapor Deposition of Cobalt Nitride and its service Email alerting
Authors
Deo Li
Ecs J Solid
+10 more
Harish B Shenai
Hoon Yang
Huazhi Lehn
Jean-Sébastien M Wang
Jing Bhandari
Min
Qing Gordon
Roy G Lin
State Technol Sci
Youbo Kim
Publication date
31 March 2020
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Abstract
Abstract is not available.
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oai:CiteSeerX.psu:10.1.1.1044....
Last time updated on 07/12/2020
