Abstract: Electroless nickel (EN) and EN composite with SiC and Sn-SiC were deposited by chemical deposition. The microstructure analysis was conducted with scanning electron microscopy, Thin film indicated that the presence of SiC particles did not affect the microstructure of the Ni-P alloy matrix when annealing temperature was below 400°C. EDAX (Energy dispersive x-ray analysis) technique have been applied in order to investigate the chemical composition and indicated that linear relation between SiC concentrations and SiC content. Microhardness of electroless Ni-Sn-P deposite, Ni-P-SiC composite and Ni-Sn-P-SiC composite were studied. Microhardness reached to the maximum value after heating to 400ºC for 1h. Microhardness follow the sequence Ni-P-SiC > Ni-Sn-P-SiC > Ni-P > Ni-Sn-P. Finally, the corrosion resistance of different SiC content and constant concentration of SnCl2 was studied in different corrosive solutions (1M H2SO4 and 3.5% NaCl solution)
