2 research outputs found

    A MEMS Dual Vertical Electrometer and Electric Field-Mill

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    Presented is the first iteration of a Microelectromechanical System (MEMS) dual vertical electrometer and electric field-mill (EFM). The device uses a resonating structure as a variable capacitor that converts the presence of a charge or field into an electric signal. Previous MEMS electrometers are lateral electrometers with laterally spaced electrodes that resonate tangentially with respect to each other. Vertical electrometers, as the name suggests, have vertically spaced electrodes that resonate transversely with respect to each other. The non-tangential movement reduces damping in the system. Both types demonstrate comparable performance, but the vertical electrometer does so at a fraction of the size. In addition, vertical electrometers can efficiently operate as an electric field sensor. The electric field sensor simulations did not compare as well to other MEMS electric field sensors. However, the dual nature of this device makes it appealing. These devices can be used in missiles and satellites to monitor charge buildup in electronic components and the atmosphere [11]. Future iterations can improve these devices and give way to inexpensive, high-resolution electrostatic charge and field sensors

    Design, Fabrication and Characterization of a MEMS-Based Three-Dimensional Electric Field Sensor with Low Cross-Axis Coupling Interference

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    One of the major concerns in the development of three-dimensional (3D) electric field sensors (EFSs) is their susceptibility to cross-axis coupling interference. The output signal for each sensing axis of a 3D EFS is often coupled by electric field components from the two other orthogonal sensing axes. In this paper, a one-dimensional (1D) electric field sensor chip (EFSC) with low cross-axis coupling interference is presented. It is designed to be symmetrical, forming a pair of in-plane symmetrically-located sensing structures. Using a difference circuit, the 1D EFSC is capable of sensing parallel electric fields along symmetrical structures and eliminating cross-axis coupling interference, which is contrast to previously reported 1D EFSCs designed for perpendicular electric field component measurement. Thus, a 3D EFS with low cross-axis coupling interference can be realized using three proposed 1D EFSCs. This 3D EFS has the advantages of low cross-axis coupling interference, small size, and high integration. The testing and calibration systems of the proposed 3D EFS were developed. Experimental results show that in the range of 0–120 kV/m, cross-axis sensitivities are within 5.48%, and the total measurement errors of this 3D EFS are within 6.16%
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