Process for making RF shielded cable connector assemblies and the products formed thereby

A process for making RF shielded cable connector assemblies and the resulting structures is described. The process basically consists of potting wires of a shielded cable between the cable shield and a connector housing to fill in, support, regidize, and insulate the individual wires contained in the cable. The formed potting is coated with an electrically conductive material so as to form an entirely encompassing adhering conductive path between the cable shield and the metallic connector housing. A protective jacket is thereby formed over the conductive coating between the cable shield and the connector housing

Localized plasmons in graphene-coated nanospheres

We present an analytical derivation of the electromagnetic response of a spherical object coated by a conductive film, here exemplified by a graphene coating. Applying the framework of Mie-Lorenz theory augmented to account for a conductive boundary condition, we derive the multipole scattering coefficients, modified essentially through the inclusion of an additive correction in numerator and denominator. By reductionist means, starting from the retarded response, we offer simple results in the quasistatic regime by analyzing the multipolar polarizability and associated dispersion equation for the localized plasmons. We consider graphene coatings of both dielectric and conducting spheres, where in the former case the graphene coating introduces the plasmons and in the latter case modifies in interesting ways the existing ones. Finally, we discuss our analytical results in the context of extinction cross-section and local density of states. Recent demonstrations of fabricated spherical graphene nanostructures make our study directly relevant to experiments.Comment: 9 pages, 5 figures, 1 tabl

Method of Attaching Strain Gauges to Various Materials

A method is provided to bond strain gauges to various materials. First, a tape with an adhesive backing is placed across the inside of the fixture frame. The strain gauge is flatly placed against the adhesive backing and coated with a thin, uniform layer of adhesive. The tape is then removed from the fixture frame and placed, strain gauge side down, on the material to be tested. If the material is a high reluctance material, the induction heating source is placed on the tape. If the material is a low reluctance material, a plate with a ferric side and a rubber side is placed, ferric side down, onto the tape. The induction heating source is then placed upon the rubber side. If the material is an insulator material, a ferric plate is placed on the tape. The induction heating source is then placed on the ferric plate. The inductive heating source then generates frequenty from 60 to 70 kilocycles to inductively heat either low reluctance material, ferric side, of ferric plate and provides incidental pressure of approximately five pounds per square inch to the tape for two minutes, thoroughly curing the adhesive. The induction heating source, and, if necessary, the plate or ferric plate, are then removed from the tape after one minute. The tape is then removed from the bonded strain gauge

An antireflection transparent conductor with ultralow optical loss (o2 %) and electrical resistance (o6O 2)

Transparent conductors are essential in many optoelectronic devices, such as displays, smart windows, light-emitting diodes and solar cells. Here we demonstrate a transparent conductor with optical loss of B1.6%, that is, even lower than that of single-layer graphene (2.3%), and transmission higher than 98% over the visible wavelength range. This was possible by an optimized antireflection design consisting in applying Al-doped ZnO and TiO2 layers with precise thicknesses to a highly conductive Ag ultrathin film. The proposed multilayer structure also possesses a low electrical resistance (5.75O 2), a figure of merit four times larger than that of indium tin oxide, the most widely used transparent conductor today, and, contrary to it, is mechanically flexible and room temperature deposited. To assess the application potentials, transparent shielding of radiofrequency and microwave interference signals with B30 dB attenuation up to 18 GHz was achieved.Peer ReviewedPostprint (author's final draft

Manufacturing flexible light-emitting polymer displays with conductive lithographic film technology

We report on a new low-cost manufacturing process for flexible displays that has the potential to rapidly expand the market into areas that have traditionally been outside the scope of such technology. In this paper we consider the feasibility of using offset-lithography to deposit contacts for polymer light-emitting displays. We compare and contrast manufacturing criteria and present a case study detailing our initial results. It is expected that these developments will stimulate further progress in multilayer device fabrication. Cheap, flexible conductive interconnects have the potential to find applications in a wide variety of device structures. For the more challenging exploitation areas in multilayer devices, such as displays, it was found that the properties of conductive lithographic films were not optimal in their current form. Three parameters (conductivity, surface roughness and surface work function) were identified as critical to device fabrication. Calendering and electroless plating were investigated as methods to improve these properties. Both methods aimed to modify the surface roughness and conductivity, with the plating study also modifying the work function

Evaluation of the morphology of metal particles in intrinsic conductive polymer dispersions

For the production of smart textiles the resistivity of prints and coatings with intrinsic conductive polymers is often too high and the performance properties not sufficient. The addition of metal components enhances many characteristics, however the choice of type of metal, morphology and application method influence results to great extend

Hazards protection for space suits and spacecraft

A flexible multi-layered covering article for protection against the hazards of exposure to the environment of outer space is disclosed. The covering includes an outer layer section comprising an outermost lamina of woven expanded tetrafluoroethylene yarns (Gore Tex) for protecting against abrasion and tearing, an underlying weave of meta-aramid yarns (Nomex) and para-aramid yarns (Kevlar) for particle impart protection, and electrostatic charge dissipation and control system incorporated therein, and a chemical contaminants control barrier applied as a coating. A middle section includes a succession of thermal insulating layers of polymeric thermoplastic or thermoforming material, each of which is coated with a metal deposit of high infra-red emissivity and low solar radiation absorption characteristics and separated from adjacent insulating layers by a low thermal conductance material. The covering further includes a radiation attenuating layer of a tungsten-loaded polymeric elastomer binder for protecting against bremsstrahlung radiation and an inner layer of rip-stop polyester material for abrasion protection. A chloroprene coating may be supplied the polyester-material for added micrometeroid protection. Securing means of low heat conductance material secures the multi-layers together as a laminar composite