Thermal evaluation and modelling of the SIP9 and SP10 MEMS packages

The SIP9 and SP10 packages are cheap plastic packages applicable for a broad range of MEMS applications. They are frequently used for packaging thermally operated MEMS, so knowing the thermal characteristics of the packages is very important. The paper presents an exhaustive thermal analysis of these packages, with various simulation tools and measurements. From the numerous experiments we draw conclusions not only about the thermal behaviour of the packages, but about the comparative features of the applied simulation and measurement tools as well. We compare the effectiveness of 2D and 3D simulation tools, discussing the advantages and drawbacks for the present applications. Both simulation based and measurement based transient thermal compact models are presented and evaluated

Thermal evaluation and modeling of MEMS packages

International audienceThe SIP9 and SP10 packages are cheap plastic packages applicable for a broad range of MEMS applications. They are frequently used for packaging thermally operated MEMS, so knowing the thermal characteristics of the packages is very important. The paper presents an exhaustive thermal analysis of these packages, with various simulation tools and measurements. From the numerous experiments we draw conclusions not only about the thermal behaviour of the packages, but about the comparative features of the applied simulation and measurement tools as well. We compare the effectiveness of 2D and 3D simulation tools, discussing the advantages and drawbacks for the present applications. Both simulation and measurement have transient thermal compact models are presented and evaluated

Thermal evaluation and modelling of the SIP9 and SP10 MEMS packages

International audienceThe SP9 and SP10 packages are cheap plastic packages applicable for a broad range of MEMS applications. They are frequently used for packaging thermally operated MEMS, so knowing the thermal characteristics of the packages is very important. The paper presents an exhaustive thermal analysis of these packages; with various simulation tools and measurements. From the numerous experiments we draw conclusions not only about the thermal behaviour of the packages, but about the comparative features of the applied simulation and measurement tools as well. We compare the effectiveness of 2D and 3D simulation tools, discussing the advantages and drawbacks for the present applications. Both simulation based and measurement based transient thermal compact models are presented and evaluated

Test structure for thermal monitoring

International audienceThe paper is dealing with thermal test structures for CMOS ICs. A new temperature sensor/test structure is proposed: the Thermal Feedback Oscillator (TFO). Detailed design considerations are presented together with experimental results. Moreover the paper discusses general questions of the "design for thermal testability" (DfTT) principle including both the problems of placement of the test structures and possible solutions for the read-out of the test data