Compatibility of lead-free solders with PCB materials

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Creep properties of SnAgCu solder in surface mount assemblies

SIGLEAvailable from British Library Document Supply Centre-DSC:6180.5139(51) / BLDSC - British Library Document Supply CentreGBUnited Kingdo

Processability of lead-free component termination materials

SIGLEAvailable from British Library Document Supply Centre-DSC:6180.5139(47) / BLDSC - British Library Document Supply CentreGBUnited Kingdo

Predicting microstructure of mixed solder alloy systems

SIGLEAvailable from British Library Document Supply Centre-DSC:6180.5139(83) / BLDSC - British Library Document Supply CentreGBUnited Kingdo

An experimental validation of modelling for Pb-free solder joint reliability

SIGLEAvailable from British Library Document Supply Centre-DSC:6180.5139(11) / BLDSC - British Library Document Supply CentreGBUnited Kingdo

Reworking solder alloy mixtures of lead-free and tin-lead alloys

SIGLEAvailable from British Library Document Supply Centre-DSC:6180.5139(73) / BLDSC - British Library Document Supply CentreGBUnited Kingdo