39 research outputs found

    Influence of strain and polycrystalline ordering on magnetic properties of high moment rare earth metals and alloys

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    Abstract Despite being the most suitable candidates for solenoid pole pieces in state-of-the-art superconductor-based electromagnets, the intrinsic magnetic properties of heavy rare earth metals and their alloys have gained comparatively little attention. With the potential of integration in micro and nanoscale devices, thin films of Gd, Dy, Tb, DyGd and DyTb were plasma-sputtered and investigated for their in-plane magnetic properties, with an emphasis on magnetization versus temperature profiles. Based on crystal structure analysis of the polycrystalline rare earth films, which consist of a low magnetic moment fcc layer at the seed interface topped with a higher moment hcp layer, an experimental protocol is introduced which allows the direct magnetic analysis of the individual layers. In line with the general trend of heavy lanthanides, the saturation magnetization was found to drop with increasing unit cell size. In situ annealed rare earth films exceeded the saturation magnetization of a high-moment Fe65Co35 reference film in the cryogenic temperature regime, proving their potential for pole piece applications; however as-deposited rare earth films were found completely unsuitable. In agreement with theoretical predictions, sufficiently strained crystal phases of Tb and Dy did not exhibit an incommensurate magnetic order, unlike their single-crystal counterparts which have a helical phase. DyGd and DyTb alloys followed the trends of the elemental rare earth metals in terms of crystal structure and magnetic properties. Inter-rare-earth alloys hence present a desirable blend of saturation magnetization and operating temperature.</jats:p

    Optical properties of Au-Hf thin films

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    The optical properties of thin films of intermetallic Au3_{3}Hf were experimentally investigated for the first time, which display clear plasmonic properties in the optical and near infrared region with negative permittivity. In contrast to similar alloys, such as films of Au3_{3}Zr, the films express more negative ϵ′\epsilon' values and lower ϵ′′\epsilon'' values across most of the wavelengths (370-1570 nm) investigated. The Au3_{3}Hf films were fabricated by DC magnetron sputtering at a range of deposition temperatures, from room temperature to 415o^{o}C, and annealed at different vacuum levels. The films mostly formed as a combination of Au3_{3}Hf, Au2_{2}Hf and Au4_{4}Hf phases when deposited below 400o^{o}C, and exclusively Au3_{3}Hf phase at above 400o^{o}C, indicating key conditions for isolating this phase. The films were stable when annealed at 10−8^{-8} Torr, but when annealed again at 10−6^{-6} Torr the films oxidised and changed into a mix of Au- Hf phases, suggesting resistance to oxidization may be an issue for un-encapsulated applications at elevated temperatures.Comment: 19 pages, including references, plus 3 pages of supplementary material. 8 figures and 1 table in main text, 1 figure and 1 table in supplementary materia

    Synthesis of plasmonically active titanium nitride using a metallic alloy buffer layer strategy

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    Titanium nitride (TiN) has emerged as a highly promising alternative to traditional plasmonic materials. This study focuses on the inclusion of a Cr90Ru10 buffer layer between the substrate and the thin TiN film, which enables the use of cost-effective, amorphous technical substrates while preserving high film quality. We report best-in-class TiN thin films fabricated on fused silica wafers, achieving a maximum plasmonic figure of merit (FOM), -ε′/ε′′ of approximately 2.8, even at a modest wafer temperature of around 300°C. Furthermore, we delve into the characterization of TiN thin film quality and fabricated TiN triangular nanostructures, employing attenuated total reflectance and cathodoluminescence techniques to highlight their potential applications in surface plasmonics

    Synthesis of plasmonically active titanium nitride using a metallic alloy buffer layer strategy

    No full text
    Titanium nitride (TiN) has emerged as a highly promising alternative to traditional plasmonic materials. This study focuses on the inclusion of a Cr90Ru10 buffer layer between the substrate and thin TiN film, which enables the use of cost-effective, amorphous technical substrates while preserving high film quality. We report best-in-class TiN thin films fabricated on fused silica wafers, achieving a maximum plasmonic figure of merit, −ϵ′/ϵ″, of approximately 2.8, even at a modest wafer temperature of around 300 °C. Furthermore, we delve into the characterization of TiN thin film quality and fabricated TiN triangular nanostructures, employing attenuated total reflectance and cathodoluminescence techniques to highlight their potential applications in surface plasmonics.<br/
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