37 research outputs found
Decomposition studies of no-clean solder flux systems in connection with corrosion reliability of electronics
Get PDFContamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating
Get PDFExperimental study of humidity distribution inside electronic enclosure and effect of internal heating
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Corrosion reliability of electronics: the influence of solder temperature on the decomposition of flux activators
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Experimental study of humidity and temperature profile into electronic enclosure exposed to high humidity and thermal cycles
Get PDFImpact of hygroscopicity and composition of solder flux residue on the reliability of PCBA under corrosive conditions
Get PDFParametric study of interior climate in electronic device enclosures and corrosion reliability
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