47 research outputs found

    Improved silicon quantum dots single electron transfer operation with hydrogen silsesquioxane resist technology

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    Hydrogen silsesquioxane (HSQ) is a high resolution electron beam resist that offers a high etch resistance and small line edge roughness. In our previous work, we showed that by using this resist we can fabricate very high density double quantum dot (QD) single electron transistors on silicon-on-insulator (SOI) substrates for applications in quantum information processing. We observed that 80% of 144 fabricated devices had dimensional variations of ±5 nm with a standard deviation of 3.4 nm. Here, we report on the functionality of our Si QD devices through electrical measurements and further HSQ process optimisations, which improve the effective side gates control on single electron operation

    Design and fabrication of densely integrated silicon quantum dots using a VLSI compatible hydrogen silsesquioxane electron beam lithography process

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    Hydrogen silsesquioxane (HSQ) is a high resolution negative-tone electron beam resist allowing for direct transfer of nanostructures into silicon-on-insulator. Using this resist for electron beam lithography, we fabricate high density lithographically defined Silicon double quantum dot (QD) transistors. We show that our approach is compatible with very large scale integration, allowing for parallel fabrication of up to 144 scalable devices. HSQ process optimisation allowed for realisation of reproducible QD dimensions of 50 nm and tunnel junction down to 25 nm. We observed that 80% of the fabricated devices had dimensional variations of less than 5 nm. These are the smallest high density double QD transistors achieved to date. Single electron simulations combined with preliminary electrical characterisations justify the reliability of our device and process

    Realization of Al FinFET single electron turnstile co-integrated with a close proximity electrometer SET

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    In the past few years, spin qubits in Si quantum dots (QDs) have demonstrated great potential to fulfill the Loss DiVincenzo quantum computing criteria [1]. Although good controllability of single electron spins has been demonstrated for QDs defined on the two-dimensional electron gas (2DEG) formed at the GaAs/AlGaAs heterojunction by using top-down lithography [2], the coherence of electron spins deteriorates rapidly in GaAs due to rich nuclear spins in GaAs. Electron spins confined in silicon based QDs are expected to have longer coherence time thanks to the low nuclear spin density of silicon based materials, with coherence times as long as 6 seconds recently been demonstrated [3]. This has further asserted the advantage of using Si as a platform to realize spin qubits and several Si QD structures have been investigated in silicon on insulator (SOI) [4], [5] and Si (2DEG) [6]. In previous work, we have presented the design and simulation of a novel SOI-based spin qubit platform using Al FinFET gates and Si side gates. The simulations demonstrated the ability of this platform to transfer, confine and detect single electrons [7], [8]. In this letter, we report a novel fabrication process to realize high density silicon based QDs with close proximity Al and Si gates on ultrathin SOI for spin qubit applications

    Electronic band-structure of Mg1-xZnxSySe1-y semiconductor alloy

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    Materials Research Society Symposium Proceedings326139-144MRSP

    Whole cell environmental biosensor on diamond

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    10.1039/b719881gAnalyst1336739-743ANAL
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