111 research outputs found

    Dynamic formation of spherical voids crossing linear defects

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    A predictive model for the evolution of porous Ge layer upon thermal treatment is reported. We represent an idealized etched dislocation core as an axially symmetric elongated hole and computed its dynamics during annealing. Numerical simulations of the shape change of a completely spherical void via surface diffusion have been performed. Simulations and experiments show individual large spherical voids, aligned along the dislocation core. The creation of voids could facilitate interactions between dislocations, enabling the dislocation network to change its connectivity in a way that facilitates the subsequent annihilation of dislocation segments. This confirms that thermally activated processes such as state diffusion of porous materials provide mechanisms whereby the defects are removed or arranged in configurations of lower energy. This model is intended to be indicative, and more detailed experimental characterization of process parameters such as annealing temperature and time, and could estimate the annealing time for given temperatures, or vice versa, with the right parameters.Comment: 7 pages, 3 figure

    Hybrid MBE-CBE Growth and Characterization of Al 0.48 In 0.52 As on InP(100) for avalanche photodiode applications Motivation

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    International audienceIn this work, we demonstrate the epitaxial growth of high quality, low strain and low background doping of Al0.48In0.52As at 500°C on Fe-doped semi-insulating InP(100) substrate by using hybrid MBE-CBE technique. The precursors that were used are: solid aluminum, solid indium, TriMethylIndium (TMIn) and thermally cracked arsine. Using Nomarski, we observed smooth surfaces for the as grown layers. High-Resolution X-ray Diffraction (HR-XRD) in the vicinity of the (004) reflexion shows a lattice mismatch in the range -137 to 127ppm. The carrier density of undoped layers, obtained by Hall measurement at room temperature, is as low as 3E+15 cm-3 which is three orders of magnitude lower than the identical layers grown by organometallics sources. Photoluminescence (PL) for Al0.48In0.52As at low temperature (LT) shows a good optical quality. The quality and purity of the alloys grown here are compatible with high performance APD for optical communication

    Chemical composition of nanoporous layer formed by electrochemical etching of p-type GaAs

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    Abstract : We have performed a detailed characterization study of electrochemically etched p-type GaAs in a hydrofluoric acid-based electrolyte. The samples were investigated and characterized through cathodoluminescence (CL), X-ray diffraction (XRD), energy-dispersive X-ray spectroscopy (EDX), and X-ray photoelectron spectroscopy (XPS). It was found that after electrochemical etching, the porous layer showed a major decrease in the CL intensity and a change in chemical composition and in the crystalline phase. Contrary to previous reports on p-GaAs porosification, which stated that the formed layer is composed of porous GaAs, we report evidence that the porous layer is in fact mainly constituted of porous As2O3. Finally, a qualitative model is proposed to explain the porous As2O3 layer formation on p-GaAs substrate

    Wafer-scale detachable monocrystalline Germanium nanomembranes for the growth of III-V materials and substrate reuse

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    Germanium (Ge) is increasingly used as a substrate for high-performance optoelectronic, photovoltaic, and electronic devices. These devices are usually grown on thick and rigid Ge substrates manufactured by classical wafering techniques. Nanomembranes (NMs) provide an alternative to this approach while offering wafer-scale lateral dimensions, weight reduction, limitation of waste, and cost effectiveness. Herein, we introduce the Porous germanium Efficient Epitaxial LayEr Release (PEELER) process, which consists of the fabrication of wafer-scale detachable monocrystalline Ge NMs on porous Ge (PGe) and substrate reuse. We demonstrate monocrystalline Ge NMs with surface roughness below 1 nm on top of nanoengineered void layer enabling layer detachment. Furthermore, these Ge NMs exhibit compatibility with the growth of III-V materials. High-resolution transmission electron microscopy (HRTEM) characterization shows Ge NMs crystallinity and high-resolution X-ray diffraction (HRXRD) reciprocal space mapping endorses high-quality GaAs layers. Finally, we demonstrate the chemical reconditioning process of the Ge substrate, allowing its reuse, to produce multiple free-standing NMs from a single parent wafer. The PEELER process significantly reduces the consumption of Ge during the fabrication process which paves the way for a new generation of low-cost flexible optoelectronics devices.Comment: 17 pages and 6 figures along with 3 figures in supporting informatio
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