225 research outputs found
The median frequency of the surface EMG power spectrum in relation to motor unit firing and action potential properties
Three components determine the power spectrum of the surface EMG signal: the auto- and cross-power spectra of the firing processes and the power spectra of the motor unit action potential (MUAP). To clarify the relative contribution of these components to the median frequency (MF) of the power spectrum, a stochastic simulation model was used in which most input parameters [e.g., MUAP peak-peak time (PPT), mean interpulse interval time, and synchronization parameters] were described in terms of distribution functions. Simulation clearly predicts that MF is especially sensitive to variations in MUAP shape, the MUAP PPT, and synchronization. The influence of the firing process parameters was predicted to be marginal. To obtain values for the MUAP parameters, a needle-triggered averaging technique was used to gather surface MUAPs from the m. biceps brachii. With use of these MUAPs as input for the model, it was found that intrasubject variability of MF is caused by variations in both MUAP PPT and MUAP shape, whereas intersubject variability in MF is caused primarily by variations in PPT
A phosphorus NMR study of the reaction products of cis-diamminedichloroplatinum (II) with a double-helical oligonucleotide and with DNA
AbstractThe structural distortion of oligonucleotides upon cis-PtCl2(NH3)2{d(T-C-T-C-G-G-T-C-T'-C-N7(5) N7(6)} reveals shifting of 4 phosphorus resonances due to platination. 3 Resonances could be assigned by selective 31P-irradiation, showing P(6) (P between the two Gs) to be shifted 1.5 ppm to low field. In the concomitant double strands P(6) is shifted 0.9 ppm to lower field. A similar peak has been observed in platinated salmon sperm DNA (37°C), indicating that Pt-binding to GpG-fragments in DNA is similar to that found for the decanucleotide, so the distortion of DNA might be comparable
Finite element and semi-analytic modeling of the temperature field of a wafer with moving heat loads
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