The spontaneous reaction of Cu(hfac) (TMVS) Vapor with DuPont Teflon AF1660

Preliminary X-ray photoelectron spectroscopic (XPS) and time-of-flight secondary ion mass spectroscopic (TOF-SIMS) measurements have confirmed the reaction of Teflon AF1600 with vapors of copper (hexafluoroacetylacetonate) (trimethyl vinyl silane) [C(hfac)(TMVS)], when exposed in the dark. XPS reveals the deposited copper to be in the Cu*II state, while TOF-SIMS has shown the organometallic to have lost its ligands in bonding to the surface

Optimizing Additive Ratios in Alkaline Zincate Electrodeposition

Alkaline non-cyanide zinc electrogalvanizing is utilized in some plating applications. This study was conducted to evaluate the effects of a commercial carrier, booster, and leveler in a strong zinc (37.5 g/L) and alkaline (210 g/L) plating solution. Hull cell plating was used to assess the roles of each additive on the appearance of the zinc deposits produced from synthetic solutions. Bright white deposits were generated with several different combinations of additives at current densities of 170-420 A/m2. The zinc structures were characterized using x-ray diffraction and scanning electron microscopy to understand the microstructure which produced the bright deposits in order to determine the optimal conditions leading to mirror-like deposits