Three dimensional printed electronic devices realised by selective laser melting of copper/high-density-polyethylene powder mixtures

A manufacturing process with the capability to integrate electronics into 3D structures is of great importance to the development of next-generation miniaturised devices. In this study, Selective Laser Melting (SLM) was used to process copper/high-density-polyethylene (HDPE) powder mixtures to build conductive tracks in a 3D circuit system. The effects of copper/HDPE volume ratio, laser input power and scanning speed on the resistivity of CO 2 laser processed tracks were investigated. The resistivity of the tracks decreased from 26.6 ± 0.6 × 10 −4 Ωcm to 1.9 ± 0.1 × 10 −4 Ωcm as the copper volume ratio increased from 30% to 60%. However, further increasing the copper ratio to 100% resulted in poor conductivity. The lowest resistivity was achieved with an input power of 20 W and scanning speed of 80 mm/s. Additionally, processing using single-track-scanning and raster-scanning programs was compared; the overall energy distribution on the surface was more uniform using a raster-scanning program, which further reduced the resistivity to 0.35 ± 0.04 × 10 −4 Ωcm. Based on the results, a 3D multi-layered circuit system was manufactured with the HDPE as the substrate/matrix material and copper/HDPE mixture as the conductive-track material. This circuit system was successfully manufactured, demonstrating the possibility of using SLM technology to manufacture dissimilar materials towards 3D electronic applications