40 research outputs found
Understanding Students’ Cognitive and Affective Attitude and Attitudinal Structures Toward Physical Activity: A Person-Centered Approach
Objectives: The purpose of this study was to determine the proportions of students who were holding positive, negative, and neutral cognitive/affective attitude and different cognitive-affective attitudinal structures toward moderate-to-vigorous physical activity (MVPA) using a person-centered approach. Methods: A total of 3949 students participated in this study (1065 middle-school students, 784 high-school students, and 2100 college students). Results: A majority of students were holding positive cognitive (about 94%) and affective attitude (about 85%) toward MVPA. Most students (about 84%) held the Positive cognitive—Positive affective attitudinal structure toward MVPA. School level influenced the proportions of students who were holding different cognitive attitude status, affective attitude status, and cognitive-affective attitudinal structures; gender and body weight status did not significantly influence them. Conclusions: This study furthers our understandings on students’ attitude and attitudinal structures toward PA. It lays the foundation for the development of physical education curriculum or PA programs that aim at promoting students’ PA behavior through changing their PA attitude. Future studies are needed to examine the effects of different attitude statuses and attitudinal structures on PA behavior
Attitude and Attitudinal Structures Toward Physical Education and Their Influences on Physical Activity Behavior
Objectives: The purpose of this study was to examine middle and high school students’ cognitive and affective attitude and their cognitive-affective attitudinal structures toward physical education (PE). The effects of cognitive and affective attitude and attitudinal structures on physical activity (PA) in PE and outside of school were also examined. Methods: 1773 Chinese middle and high-school students participated in this study. SEM, Chi-square test, ANOVAs, and Contingency tables were adopted to address the research questions. Results: The results showed that most students (\u3e90%) were holding positive cognitive and affective attitude toward PE. Students’ affective attitude significantly influences their PA in PE and outside of school. Most students were holding the positive cognitive-positive negative attitudinal structure toward PE. Conclusions: All these findings lay important foundations for future theoretical advancement about attitude toward PE and provide guidance for PE teachers on attitude intervention and PA promotion
Strain Rate and Temperature Effects on Tensile Properties of Polycrystalline Cu6Sn5 by Molecular Dynamic Simulation
Intermetallic compounds (IMCs) are essential in the soldering of electronic products and are composed mainly of Cu6Sn5 and Cu3Sn. They must maintain reliable mechanical and electrical connections. As they are usually only a few microns thick, and it is difficult to study their mechanical properties by traditional methods. In this study, a 100 Å × 100 Å × 100 Å polycrystal with 10 grains was created by Atomsk through Voronoi tessellation based on a Cu6Sn5 unit cell. The effects of the temperature and strain rate on the tensile properties of the polycrystalline Cu6Sn5 were analyzed based on MEAM potential function using a molecular dynamics (MD) method. The results show that Young’s modulus and ultimate tensile strength (UTS) of the polycrystalline Cu6Sn5 decrease approximately linearly with an increase in temperature. At high strain rates (0.001–100 ps−1), Young’s modulus and UTS of the Cu6Sn5 are logarithmic with respect to the strain rate, and both increase with an increase in strain rate. In addition, at low strain rates (0.00001–0.0005 ps−1), the UTS has a quadratic increase as the strain rate increases
Grain Size Effects on Mechanical Properties of Nanocrystalline Cu6Sn5 Investigated Using Molecular Dynamics Simulation
Intermetallic compounds (IMCs) are inevitable byproducts during the soldering of electronics. Cu6Sn5 is one of the main components of IMCs, and its mechanical properties considerably influence the reliability of solder joints. In this study, the effects of grain size (8–20 nm) on the mechanical properties (Young’s modulus, yield stress, ultimate tensile strength (UTS), and strain rate sensitivity) of polycrystalline Cu6Sn5 were investigated using molecular dynamics simulations at 300 K and at a strain rate of 0.0001–10 ps−1. The results showed that at high strain rates, grain size only slightly influenced the mechanical properties. However, at low strain rates, Young’s modulus, yield stress, and UTS all increased with increasing grain size, which is the trend of an inverse Hall–Petch curve. This is largely attributed to the sliding and rotation of grain boundaries during the nanoscale stretching process, which weakens the interaction between grains. Strain rate sensitivity increased with a decrease in grain size
Adaptive Neural Network Control of Serial Variable Stiffness Actuators
This paper focuses on modeling and control of a class of serial variable stiffness actuators (SVSAs) based on level mechanisms for robotic applications. A multi-input multi-output complex nonlinear dynamic model is derived to fully describe SVSAs and the relative degree of the model is determined accordingly. Due to nonlinearity, high coupling, and parametric uncertainty of SVSAs, a neural network-based adaptive control strategy based on feedback linearization is proposed to handle system uncertainties. The feasibility of the proposed approach for position and stiffness tracking of SVSAs is verified by simulation results
Integrated Approach to Obtain Gas Flow Velocity in Convection Reflow Soldering Oven
The nozzle-matrix gas flow velocity has a great influence on the accuracy of the temperature field of a printed circuit board assembly (PCBA) during the hot air convection reflow soldering process. This paper proposes a new approach that integrates the theoretical calculation, numerical simulation and an experimental test to accurately determine the nozzle-matrix gas flow velocity. First, the temperature profile of the aluminum alloy thin plate in convection reflow ovens is measured using a Wiken tester. Second, the nozzle-matrix gas flow velocity is theoretically calculated with the Martin formula. The computational fluid dynamic (CFD)simulation is performed according to the Icepak code, where a single oven chamber model is established to represent the 10 zones of soldering ovens to reduce computational resources considering the supry of the soldering ovens. The simulated temperature profile of the aluminum alloy thin plate is obtained and the specific response surface model (RSM) is established to represent the deviation between the simulated temperature and the measured temperature. Finally, based on reverse problem analysis, non-linear programming by quadratic Lagrangian (NLPQL) is used to solve the mathematical optimization model with the objective of minimizing the temperature deviation to obtain the corrected nozzle-matrix gas flow velocity. To validate the accuracy, the temperature test and the modeling using the corrected gas flow velocity for a new PCBA component for the soldering ovens is conducted separately. The temperature comparison between the simulation and the test shows that the maximum temperature deviation is within 10 °C. This provides evidence that the nozzle-matrix gas flow velocity obtained by the new approach is accurate and effective