Fully Point-wise Convolutional Neural Network for Modeling Statistical Regularities in Natural Images

Modeling statistical regularity plays an essential role in ill-posed image processing problems. Recently, deep learning based methods have been presented to implicitly learn statistical representation of pixel distributions in natural images and leverage it as a constraint to facilitate subsequent tasks, such as color constancy and image dehazing. However, the existing CNN architecture is prone to variability and diversity of pixel intensity within and between local regions, which may result in inaccurate statistical representation. To address this problem, this paper presents a novel fully point-wise CNN architecture for modeling statistical regularities in natural images. Specifically, we propose to randomly shuffle the pixels in the origin images and leverage the shuffled image as input to make CNN more concerned with the statistical properties. Moreover, since the pixels in the shuffled image are independent identically distributed, we can replace all the large convolution kernels in CNN with point-wise ($1*1$) convolution kernels while maintaining the representation ability. Experimental results on two applications: color constancy and image dehazing, demonstrate the superiority of our proposed network over the existing architectures, i.e., using 1/10$\sim$1/100 network parameters and computational cost while achieving comparable performance.Comment: 9 pages, 7 figures. To appear in ACM MM 201

Copper coin-embedded printed circuit board for heat dissipation: manufacture, thermal simulation and reliability

Purpose - The purpose of this paper is to form copper coin-embedded printed circuit board (PCB) for high heat dissipation. Design/methodology/approach - Manufacturing optimization of copper coin-embedded PCB involved in the design and treatment of copper coin, resin flush removal and flatness control. Thermal simulation was used to investigate the effect of copper coin on heat dissipation of PCB products. Lead-free reflow soldering and thrust tests were used to characterize the reliable performance of copper coin-embedded PCB. Findings - The copper coin-embedded PCB had good agreement with resin flush removal and flatness control. Thermal simulation results indicated that copper coin could significantly enhance the heat-dissipation rate by means of a direct contact with the high-power integrated circuit chip. The copper coin-embedded PCB exhibited a reliable structure capable of withstanding high-temperature reflow soldering and high thrust testing. Originality/value - The use of a copper coin-embedded PCB could lead to higher heat dissipation for the stable performance of high-power electronic components. The copper coin-embedded method could have important potential for improving the design for heat dissipation in the PCB industry

Quantitative assessment of image motion blur in diffraction images of moving biological cells

Motion blur (MB) presents a significant challenge for obtaining high-contrast image data from biological cells with a polarization diffraction imaging flow cytometry (p-DIFC) method. A new p-DIFC experimental system has been developed to evaluate the MB and its effect on image analysis using a time-delay-integration (TDI) CCD camera. Diffraction images of MCF-7 and K562 cells have been acquired with different speed-mismatch ratios and compared to characterize MB quantitatively. Frequency analysis of the diffraction images shows that the degree of MB can be quantified by bandwidth variations of the diffraction images along the motion direction. The analytical results were confirmed by the p-DIFC image data acquired at different speed-mismatch ratios and used to validate a method of numerical simulation of MB on blur-free diffraction images, which provides a useful tool to examine the blurring effect on diffraction images acquired from the same cell. These results provide insights on the dependence of diffraction image on MB and allow significant improvement on rapid biological cell assay with the p-DIFC method

Electroacupuncture ameliorates peptic ulcer disease in association with gastroduodenal microbiota modulation in mice

Peptic ulcer disease (PUD) is a common disease and frequently encountered in the clinic. Accumulating evidence suggests that PUD is associated with the gastrointestinal microbiota. Electroacupuncture (EA) is an improved version of acupuncture, which can improve the clinical effect by increasing the stimulation and delivering appropriate electrical pulses to needles. This method has been widely used in the treatment of peptic ulcer disease. However, its effect on gastrointestinal microbiota remains unclear. Therefore, in the present study, the ameliorative effect of EA was evaluated on the gastroduodenal mucosa, and the regulatory effect of the gastroduodenal microbiota was assessed in PUD mice. A total of 48 male Kun Ming mice were randomly divided into the following groups: normal control group (NC), PUD model group (PUD), Shousanli group (LI10), and Zusanli group (ST36) (n=12). The mice in groups LI10 and ST36 were treated with EA at LI10 and ST36, respectively. This intervention was continued for 7 days. Subsequently, we evaluated the morphological changes in the gastric and duodenal mucosa, and specific indices were measured, including the contents of serum dopamine (DA), the trefoil factor (TFF), and the vasoactive intestinal peptide (VIP). In addition, the gastric and duodenal microbiota were assessed via 16S ribosomal DNA sequencing. The results indicated that EA at LI10 or ST36 significantly reduced the injury of the gastroduodenal mucosa in PUD mice. The gastric microbial community structure of the groups LI10 and ST36 was similar to that of the NC group following comparison with the microbial community structure of the PUD model group. Moreover, the abundance of Firmicutes in the stomach was decreased, whereas that of Bacteroidetes was increased, and the abundance of Firmicutes in the duodenum was decreased. Furthermore, the microbial diversity and richness of the gastric microbiota in group LI10 were also significantly increased, and the serum dopamine and trefoil factor levels in group ST36 were significantly increased. Therefore, it is suggested that EA ameliorating PUD is in association with improving the levels of DA and TFF and regulating the relative abundances of Firmicutes and Bacteroidetes in the gastric microbiota

Effects of surface-functionalized aluminum nitride on thermal, electrical, and mechanical behaviors of polyarylene ether nitrile-based composites

Aluminum nitride (AlN) with high thermal conductivity was blended in polyarylene ether nitrile (PEN) to obtain a composite system. A ball milling process could provide AlN particles of smaller size with higher surface silylation for homogeneous particle distribution in polymeric matrix. Thermal, electrical, and mechanical behaviors of the produced composites were characterized to investigate the effects of particles on the performance of PEN-based composites with functionalized AlN. The composite exhibited thermal conductivity of 0.779 W m−1 K−1, a dielectric constant of 7.7, dielectric loss of 0.032, electrical resistivity of 1.39 GΩ.cm, and break strength of 36 N when the fraction of functionalized AlN increased to 42.3 vol%. A fitted equation based on the improved Russell's model could effectively predict a trend for thermal conductivity of the composite systems with consideration of interfacial resistance between AlN and surrounding PEN

Characterization and application of aggregated porous copper oxide flakes for cupric source of copper electrodeposition

Copper oxide was prepared with thermal decomposition of basic copper carbonate to complement the concentration of cupric ions for copper electrodeposition in a plating system with insoluble anode. Copper oxide particles with a structure of aggregated porous flakes had a wide size distribution ranging from 100 nm to 100 μm. Copper oxide exhibited a dissolution rate of about 15 s in 12.5 vol% H2SO4 solution. During copper electrodeposition, copper deposits with fine growth formed in the electrolyte with stable cupric concentration provided by rapid dissolution of copper oxide