Coherent State Control of Non-Interacting Quantum Entanglement

We exploit a novel approximation scheme to obtain a new and compact formula for the parameters underlying coherent-state control of the evolution of a pair of entangled two-level systems. It is appropriate for long times and for relatively strong external quantum control via coherent state irradiation. We take account of both discrete-state and continuous-variable degrees of freedom. The formula predicts the relative heights of entanglement revivals and their timing and duration.Comment: Published in PRA, 10 pages, 7 figure

Quantum transitions induced by the third cumulant of current fluctuations

We investigate the transitions induced by external current fluctuations on a small probe quantum system. The rates for the transitions between the energy states are calculated using the real-time Keldysh formalism for the density matrix evolution. We especially detail the effects of the third cumulant of current fluctuations inductively coupled to a quantum bit and propose a setup for detecting the frequency-dependent third cumulant through the transitions it induces.Comment: 4 pages, 3 figure

Modeling with structure of resins in electonic compornents

In recent years, interfacial fracture becomes one of the most important problems in the assessment of reliability of electronics packaging. Especially, underfill resin is used with solder joints in flip chip packaging for preventing the thermal fatigue fracture in solder joints. In general, the interfacial strength has been evaluated on the basis of interfacial fracture mechanics concept. However, as the size of devices decrease, it is difficult to evaluate the interfacial strength quantitatively. Most of researches in the interfacial fracture were conducted on the basis of the assumption of the perfectly bonding condition though the interface has the micro-scale structure and the bonding is often imperfect. In this study, the mechanical model of the interfacial structure of resin in electronic components was proposed. Bimaterial model with the imperfect bonding condition was examined by using a finite element analysis (FEA). Stress field in the vicinity of interface depends on the interfacial structure with the imperfect bonding. In the front of interfacial crack tip, the behavior of process zone is affected by interfacial structure. However, the instability of fracture for macroscopic crack which means the fracture toughness is governed by the stress intensity factor based on the fracture mechanics concept.Comment: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions