Advancement in thermal interface materials for future high-performance electronic applications. Part 1.

As electronic assemblies become more compact and increase in processing bandwidth, escalating thermal energy has become more difficult to manage. The major limitation has been nonmetallic joining using poor thermal interface materials (TIM). The interfacial, versus bulk, thermal conductivity of an adhesive is the major loss mechanism and normally accounts for an order magnitude loss in conductivity per equivalent thickness. The next generation TIM requires a sophisticated understanding of material and surface sciences, heat transport at submicron scales, and the manufacturing processes used in packaging of microelectronics and other target applications. Only when this relationship between bond line manufacturing processes, structure, and contact resistance is well-understood on a fundamental level will it be possible to advance the development of miniaturized microsystems. This report examines using thermal and squeeze-flow modeling as approaches to formulate TIMs incorporating nanoscience concepts. Understanding the thermal behavior of bond lines allows focus on the interfacial contact region. In addition, careful study of the thermal transport across these interfaces provides greatly augmented heat transfer paths and allows the formulation of very high resistance interfaces for total thermal isolation of circuits. For example, this will allow the integration of systems that exhibit multiple operational temperatures, such as cryogenically cooled detectors

Laser based micro forming and assembly.

It has been shown that thermal energy imparted to a metallic substrate by laser heating induces a transient temperature gradient through the thickness of the sample. In favorable conditions of laser fluence and absorptivity, the resulting inhomogeneous thermal strain leads to a measurable permanent deflection. This project established parameters for laser micro forming of thin materials that are relevant to MESA generation weapon system components and confirmed methods for producing micrometer displacements with repeatable bend direction and magnitude. Precise micro forming vectors were realized through computational finite element analysis (FEA) of laser-induced transient heating that indicated the optimal combination of laser heat input relative to the material being heated and its thermal mass. Precise laser micro forming was demonstrated in two practical manufacturing operations of importance to the DOE complex: micrometer gap adjustments of precious metal alloy contacts and forming of meso scale cones

Modeling microscale heat transfer using Calore.

Modeling microscale heat transfer with the computational-heat-transfer code Calore is discussed. Microscale heat transfer problems differ from their macroscopic counterparts in that conductive heat transfer in both solid and gaseous materials may have important noncontinuum effects. In a solid material, three noncontinuum effects are considered: ballistic transport of phonons across a thin film, scattering of phonons from surface roughness at a gas-solid interface, and scattering of phonons from grain boundaries within the solid material. These processes are modeled for polycrystalline silicon, and the thermal-conductivity values predicted by these models are compared to experimental data. In a gaseous material, two noncontinuum effects are considered: ballistic transport of gas molecules across a thin gap and accommodation of gas molecules to solid conditions when reflecting from a solid surface. These processes are modeled for arbitrary gases by allowing the gas and solid temperatures across a gas-solid interface to differ: a finite heat transfer coefficient (contact conductance) is imposed at the gas-solid interface so that the temperature difference is proportional to the normal heat flux. In this approach, the behavior of gas in the bulk is not changed from behavior observed under macroscopic conditions. These models are implemented in Calore as user subroutines. The user subroutines reside within Sandia's Source Forge server, where they undergo version control and regression testing and are available to analysts needing these capabilities. A Calore simulation is presented that exercises these models for a heated microbeam separated from an ambient-temperature substrate by a thin gas-filled gap. Failure to use the noncontinuum heat transfer models for the solid and the gas causes the maximum temperature of the microbeam to be significantly underpredicted