And-1 is required for homologous recombination repair by regulating DNA end resection

Homologous recombination (HR) is a major mechanism to repair DNA double-strand breaks (DSBs). Although tumor suppressor CtIP is critical for DSB end resection, a key initial event of HR repair, the mechanism regulating the recruitment of CtIP to DSB sites remains largely unknown. Here, we show that acidic nucleoplasmic DNA‐binding protein 1 (And‐1) forms complexes with CtIP as well as other repair proteins, and is essential for HR repair by regulating DSB end resection. Furthermore, And-1 is recruited to DNA DSB sites in a manner dependent on MDC1, BRCA1 and ATM, down-regulation of And-1 impairs end resection by reducing the recruitment of CtIP to damage sites, and considerably reduces Chk1 activation and other damage response during HR repair. These findings collectively demonstrate a hitherto unknown role of MDC1→And-1→CtIP axis that regulates CtIP-mediated DNA end resection and cellular response to DSBs

Epoxy composite with high thermal conductivity by constructing 3D-oriented carbon fiber and BN network structure

As electronic devices tend to be integrated and high-powered, thermal conductivity is regarded as the crucial parameter of electronic components, which has become the main factor that limits the operating speed and service lifetime of electronic devices. However, constructing continuous thermal conductive paths for low content particle fillers and reducing interface thermal resistance between fillers and matrix are still two challenging issues for the preparation of thermally conductive composites. In this study, 3D-oriented carbon fiber (CF) thermal network structures filled with boron nitride flakes (BN) as thermal conductive bridges were successfully constructed. The epoxy composite was fabricated by thermal conductive material with a 3D oriented structure by the vacuum liquid impregnation method. This special 3D-oriented structure modified by BN (BN/CF) could efficiently broaden the heat conduction pathway and connected adjacent fibers, which leads to the reduction of thermal resistance. The thermal conductivity of the boron nitride/carbon fiber/epoxy resin composite (BN/CF/EP) with 5 vol% 10 mm CF and 40 vol% BN reaches up to 3.1 W m(-1) K-1, and its conductivity is only 2.5 x 10(-4) S cm(-1). This facile and high-efficient method could provide some useful advice for the thermal management material in the microelectronic field and aerospace industry

Epoxy Composites with High Thermal Conductivity by Constructing Three-Dimensional Carbon Fiber/Carbon/Nickel Networks Using an Electroplating Method

Heat dissipation problem is the primary factor restricting the service life of an electronic component. The thermal conductivity of materials has become a bottleneck that hinders the development of the electronic information industry (such as light-emitting diodes, SG mobile phones). Therefore, the research on improving the thermal conductivity of materials has a very important theoretical value and a practical application value. Whether the thermally conductive filler in polymer composites can form a highly thermal conductive pathway is a key issue at this stage. The carbon fiber/carbon felt (CF/C felt) prepared in the study has a three-dimensional continuous network structure. The nickel-coated carbon fiber/carbon felt (CF/C/Ni felt) was fabricated by an electroplating deposition method. Three-dimensional CF/C/Ni/epoxy composites were manufactured by vacuum-assisted liquid-phase impregnation. By forming connection points between the adjacent carbon fibers, the thermal conduction path inside the felt can be improved so as to improve the thermal conductivity of the CF/C/Ni/epoxy composite. The thermal conductivity of the CF/ C/Ni/epoxy composite (in-plane KO is up to 2.13 W/(m K) with 14.0 wt % CF/C and 3.70 wt % Ni particles (60 min electroplating deposition). This paper provides a theoretical basis for the development of high thermal conductivity and high-performance composite materials urgently needed in industrial production and high-tech fields

Strategies for indica rice adapted to high-temperature stress in the middle and lower reaches of the Yangtze River

High temperatures caused by climate warming severely affect the grain yield and quality of rice. In this study, the rice cultivars Longliangyou Huazhan (LLYHZ) and Quanliangyou 2118 (QLY2118) were selected as the experimental materials for investigation of an optimal cultivation system under high-temperature treatment. In addition, the heat-resistant cultivar Huanghuazhan (HHZ) and heat-sensitive cultivar Huiliangyou 858 (HLY858) were chosen as the experimental materials to study the effects of exogenous plant growth regulators on heat stress responses under high-temperature treatment. The results showed that mechanical transplanting of carpet seedlings and delayed sowing effectively increased the leaf area index and reduced the canopy temperature of LLYHZ and QLY2118. Furthermore, carpet seedling mechanical transplantation and delayed sowing improved grain yield and quality. Spray application of five plant growth regulators revealed that brassinolide and salicylic acid had the strongest effects on significantly improving antioxidant enzyme activities in the panicle, which would reduce the damage caused by the accumulation of reactive oxygen species and enhance plant tolerance of high-temperature stress. In addition, brassinolide and salicylic acid enhanced the percentage of anther dehiscence and percentage seed set. In this study, a set of simplified eco-friendly cultivation techniques for single-season indica rice adaptation to high-temperature stress was established. These results will be of great importance in alleviating the effects of high-temperature stress on rice production

Performance of first insert coil with REBCO CICC sub-size cable exceeding 6 kA at 21 T magnetic field

The Institute of Plasma Physics at the Chinese Academy of Sciences is developing the REBCO cable in conduit conductor (CICC) technology for applications in next-generation nuclear fusion devices. The aim is to develop a CICC comprised of six REBCO sub-cables to satisfy the requirements of operation with a current of around 40 kA and a peak field of up to 20 T. To qualify the performance of the sub-size REBCO cable to be used in the CICC, two 25-turn insert solenoids have been designed, manufactured and tested at a current exceeding 6 kA subjected in a background field supplied by a water-cooled resistive magnet. The insert solenoid, wound from a 11.5 m long REBCO CORC$^{®}$ cable, was designed to investigate its current carrying capacity under high field and electromagnetic (EM) load at 4.2 K. Tests were performed under a background magnetic field up to 18.5 T, resulting in a peak magnetic field on the innermost layer turns of around 21.1 T at an operating current of 6.3 kA. The effects of operation with cyclic EM loads were tested by repeated current ramps to around 95% of the critical current. Moreover, the V–I characteristics were measured at 77 K and the self-field, to check the effects from warm-up and cool-down (WUCD) cycles between room temperature and 77 K with liquid nitrogen. The results show no obvious degradation after dozens of high-current test cycles in background fields ranging from 10 T to 18.5 T. The insert solenoid demonstrates the stable operation of the REBCO sub-size cable for CICC with EM loads of about 90 kN m$^{−1}$ and WUCD cycles between room temperature and 77 K. These promising results indicate the potential of this technology for further applicationsin particular, for full-size CICC for high-performance fusion magnets