Belle-II VXD radiation monitoring and beam abort with sCVD diamond sensors

The Belle-II VerteX Detector (VXD) has been designed to improve the performances with respect to Belle and to cope with an unprecedented luminosity of View the MathML source8 71035cm 122s 121 achievable by the SuperKEKB. Special care is needed to monitor both the radiation dose accumulated throughout the life of the experiment and the instantaneous radiation rate, in order to be able to promptly react to sudden spikes for the purpose of protecting the detectors. A radiation monitoring and beam abort system based on single-crystal diamond sensors is now under an active development for the VXD. The sensors will be placed in several key positions in the vicinity of the interaction region. The severe space limitations require a challenging remote readout of the sensors

Belle II silicon vertex detector (SVD)

The Belle II experiment at the SuperKEKB collider in Japan will operate at an unprecedented luminosity of 8 71035 cm 122s 121, about 40 times larger than its predecessor, Belle. Its vertex detector is composed of a two-layer DEPFET pixel detector (PXD) and a four layer double-sided silicon microstrip detector (SVD). To achieve a precise decay-vertex position determination and excellent low-momentum tracking under a harsh background condition and high trigger rate of 10 kHz, the SVD employs several innovative techniques. In order to minimize the parasitic capacitance in the signal path, 1748 APV25 ASIC chips, which read out signal from 224 k strip channels, are directly mounted on the modules with the novel Origami concept. The analog signal from APV25 are digitized by a flash ADC system, and sent to the central DAQ as well as to online tracking system based on SVD hits to provide region of interests to the PXD for reducing the latter\u2019s data size to achieve the required bandwidth and data storage space. Furthermore, the state-of-the-art dual phase CO2 cooling solution has been chosen for a combined thermal management of the PXD and SVD system. In this proceedings, we present key design principles, module construction and integration status of the Belle II SVD

The silicon vertex detector of the Belle II experiment

The silicon vertex detector of the Belle II experiment, structured in a lantern shape, consists of four layers of ladders, fabricated from two to five silicon sensors. The APV25 readout ASIC chips are mounted on one side of the ladder to minimize the signal path for reducing the capacitive noise; signals from the sensor backside are transmitted to the chip by bent flexible fan-out circuits. The ladder is assembled using several dedicated jigs. Sensor motion on the jig is minimized by vacuum chucking. The gluing procedure provides such a rigid foundation that later leads to the desired wire bonding performance. The full ladder with electrically functional sensors is consistently completed with a fully developed assembly procedure, and its sensor offsets from the design values are found to be less than 200. \u3bcm. The potential functionality of the ladder is also demonstrated by the radioactive source test

Belle II SVD ladder assembly procedure and electrical qualification

The Belle II experiment at the SuperKEKB asymmetric e+e- collider in Japan will operate at a luminosity approximately 50 times larger than its predecessor (Belle). At its heart lies a six-layer vertex detector comprising two layers of pixelated silicon detectors (PXD) and four layers of double-sided silicon microstrip detectors (SVD). One of the key measurements for Belle II is time-dependent CP violation asymmetry, which hinges on a precise charged-track vertex determination. Towards this goal, a proper assembly of the SVD components with precise alignment ought to be performed and the geometrical tolerances should be checked to fall within the design limits. We present an overview of the assembly procedure that is being followed, which includes the precision gluing of the SVD module components, wire-bonding of the various electrical components, and precision three dimensional coordinate measurements of the jigs used in assembly as well as of the final SVD modules