18 research outputs found
Design Optimization of Through-Silicon Vias for Substrate-Integrated Waveguides embedded in High-Resistive Silicon Interposer
No full textInternational audienceIn this work, the optimization of TSVs for SIWs embedded in a high-resistive silicon interposer is demonstrated. EM simulations are performed to analyze and optimize important TSV design parameters enabling silicon interposer technologies with low-loss SIWs working at mm-wave/THz frequencies. A silicon interposer using high resistive silicon and TSVs is fabricated and SIWs are characterized working from 110-170 GHz with very low attenuation of ~0.5 dB/mm
Martina Parge, Steuerung durch Verständigung. Zur Bedeutung kommunikativen Handelns in neuen Arbeitsformen
No full textModel Reduction of Nonlinear Systems by Trajectory Piecewise Linear Based on Output-Weighting Models: A Balanced-Truncation Methodology
No full text
Influence of heat source distributions in GaAs/GaAlAs quantum-well high-power laser arrays on temperature profile and thermal resistance
No full text
Surface chemical structures of CoO x /TiO2 catalysts for continuous wet trichloroethylene oxidation
No full text
