Thermal annealing of femtosecond laser written structures in silica glass

We have investigated the thermal stability of femtosecond laser modification inside fused silica. Raman and FL spectroscopy show that fs-laser induced non-bridging oxygen hole center (NBOHC) defects completely disappear at 300 °C, whereas changes in Si-O ring structures only anneal out after heat treatment at 800-900 °C. After annealing at 900 °C optical waveguides written inside the glass had completely disappeared whereas more significant damage induced in the glass remained. The results are related to different types of bond rearrangements in the glass network

Thermal annealing of femtosecond laser written structures in silica glass

We have investigated the thermal stability of femtosecond laser modification inside fused silica. Raman and FL spectroscopy show that fs-laser induced non-bridging oxygen hole center (NBOHC) defects completely disappear at 300 °C, whereas changes in Si-O ring structures only anneal out after heat treatment at 800-900 °C. After annealing at 900 °C optical waveguides written inside the glass had completely disappeared whereas more significant damage induced in the glass remained. The results are related to different types of bond rearrangements in the glass network