Neural Correlates of Face and Object Perception in an Awake Chimpanzee (Pan Troglodytes) Examined by Scalp-Surface Event-Related Potentials

BACKGROUND: The neural system of our closest living relative, the chimpanzee, is a topic of increasing research interest. However, electrophysiological examinations of neural activity during visual processing in awake chimpanzees are currently lacking. METHODOLOGY/PRINCIPAL FINDINGS: In the present report, skin-surface event-related brain potentials (ERPs) were measured while a fully awake chimpanzee observed photographs of faces and objects in two experiments. In Experiment 1, human faces and stimuli composed of scrambled face images were displayed. In Experiment 2, three types of pictures (faces, flowers, and cars) were presented. The waveforms evoked by face stimuli were distinguished from other stimulus types, as reflected by an enhanced early positivity appearing before 200 ms post stimulus, and an enhanced late negativity after 200 ms, around posterior and occipito-temporal sites. Face-sensitive activity was clearly observed in both experiments. However, in contrast to the robustly observed face-evoked N170 component in humans, we found that faces did not elicit a peak in the latency range of 150-200 ms in either experiment. CONCLUSIONS/SIGNIFICANCE: Although this pilot study examined a single subject and requires further examination, the observed scalp voltage patterns suggest that selective processing of faces in the chimpanzee brain can be detected by recording surface ERPs. In addition, this non-invasive method for examining an awake chimpanzee can be used to extend our knowledge of the characteristics of visual cognition in other primate species

InterPACK2011-52024 EFFECT OF THICKNESS OF PD PLATING LAYER ON SHEAR STRENGTH OF LEAD-FREE SOLDER BALL JOINT WITH ELECTROLESS NI/PD/AU PLATED ELECTRODE

ABSTRACT An electroless Ni/Pd/Au plated electrode is expected to be used as an electrode material for lead-free solder to improve joint reliability. The aim of this study is to investigate the effect of the thickness of the Pd layer on joint properties of the leadfree solder joint with the electroless Ni/Pd/Au plated electrode. Solder ball joints were fabricated with Sn-3Ag-0.5Cu (mass%) lead-free solder balls and electroless Ni/Pd/Au and Ni/Au plated electrodes. Ball shear force and microstructure of the joint were investigated. The (Cu,Ni) 6 Sn 5 reaction layer formed in the joint interface in all specimens. The thickness of the reaction layer decreased with increasing the thickness of the Pd layer. In the joint with a Pd layer 0.36 µm thick, the remained Pd layer was observed in the joint interface. In the joint, impact shear force decreased compared with that of the joint without the remained Pd layer. On the contrary, when the thickness of the Pd layer was less than 0.36 µm, the Pd layer was not remained in the joint interface and impact shear force improved. Impact shear force of the joint with the electroless Ni/Pd/Au plated electrode was higher than that with the electroless Ni/Au one

Detail analysis of puncture site complications in neuro-endovascular therapy: A single-center analysis

Objective: Puncture site complications in neuro-endovascular therapy, which represent a significant cause of morbidity, are often difficult to treat. Vascular closure devices have evolved in endovascular therapy. We analyzed risk factors for puncture site complications and examined the efficacy of hemostasis methods in neuro-endovascular therapy. Methods: This retrospective, observational, single-center study was conducted from January 2021 to January 2023. We enrolled 202 puncture sites of patients who underwent neuro-endovascular therapy at Kawaguchi Municipal Medical Center and analyzed the complications requiring additional intervention. Results: There were 12 (5.94 %) puncture site complications. No patient had permanent puncture-related complications. Univariate analyses revealed that a higher risk of puncture site complications was significantly associated with multiple antiplatelet agents (p = 0.03), hypertension (p = 0.03), scheduled treatment (p < 0.01), higher activated clotting time (ACT) immediately before sheath removal (≥310 s, p < 0.01), and the non-use of Perclose (manual compression or Angio-seal, p < 0.01). Multivariate analyses revealed that puncture site complications were significantly higher in patients with an ACT immediately before sheath removal ≥ 310 s (HR: 10.4, 95 % CI: 2.45–44.15, p < 0.01), scheduled treatment (HR: 10.16, 95 % CI: 1.81–56.95, p < 0.01), and the non-use of Perclose (HR: 21.97, 95 % CI: 2.42–199.34, p < 0.01). Conclusion: A higher ACT immediately before sheath removal was significantly associated with puncture site complications. Perclose is an efficient device, and it may reduce the risk of puncture site complications