1 research outputs found
Very high aspect ratio through-silicon vias (TSVs) fabricated using automated magnetic assembly of nickel wires
- Author
- A C Fischer
- Baron J
- Dixit P
- F Niklaus
- Fischer A
- Fischer A C Bleiker S J Somjit N Roxhed N Haraldsson T Stemme G Niklaus F
- Fischer A Roxhed N Haraldsson T Heinig N Stemme G Niklaus F
- G Stemme
- Garrou P
- Gu C
- Gu J
- Ho S W Yoon S W Zhou Q Pasad K Kripesh V Lau J
- Hoo J Park K Varel C Baskaran R Böhringer K
- Lee S Hon R Zhang S Wong C
- Liu X Chen Q Dixit P Chatterjee R Tummala R Sitaraman S
- Lu K Zhang X Ryu S-K Im J Huang R Ho P
- Mastrangeli M
- Material Property Database
- MicroChem
- N Roxhed
- Nilsson P Ljunggren A Thorslund R Hagstrom M Lindskog V
- Parylene Coating Services
- Rohm
- S J Bleiker
- Sundaram V Chen Q Suzuki Y Kumar G Liu F Tummala R
- T Haraldsson
- Tang C W
- Tezcan D Duval F Philipsen H Luhn O Soussan P Swinnen B
- Tezcan D Munck K De Pham N Luhn O Aarts A De Moor P Baert K Van Hoof C
- Tezcan D Pham N Majeed B Moor P De Ruythooren W Baert K
- The Dow Chemical Company
- Wang M-J Hung C-Y Kao C-L Lee P-N Chen C-H Hung C-P Tong H-M
- Wolf M Dretschkow T Wunderle B Jurgensen N Engelmann G Ehrmann O Uhlig A Michel B Reichl H
- Publication venue
- 'IOP Publishing'
- Publication date
- Field of study
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