High-performance thermal emitters based on laser engineered metal surfaces

Effective thermal management is of paramount importance for all high-temperature systems operating under vacuum. Cooling of such systems relies mainly on radiative heat transfer requiring high spectral emissivity of surfaces, which is strongly affected by the surface condition. Pulsed laser structuring of stainless steel in air resulted in the spectral hemispherical emissivity values exceeding 0.95 in the 2.5–15 µm spectral region. The effects of surface oxidation and topography on spectral emissivity as well as high temperature stability of the surface structures were examined. High performance stability of the laser textured surfaces was confirmed after thermal aging studies at 320°C for 96 hour

Microchannel cooling for the LHCb VELO Upgrade I

The LHCb VELO Upgrade I, currently being installed for the 2022 start of LHC Run 3, uses silicon microchannel coolers with internally circulating bi-phase \cotwo for thermal control of hybrid pixel modules operating in vacuum. This is the largest scale application of this technology to date. Production of the microchannel coolers was completed in July 2019 and the assembly into cooling structures was completed in September 2021. This paper describes the R\&D path supporting the microchannel production and assembly and the motivation for the design choices. The microchannel coolers have excellent thermal peformance, low and uniform mass, no thermal expansion mismatch with the ASICs and are radiation hard. The fluidic and thermal performance is presented.Comment: 31 pages, 27 figure

High Performance Thermal Emitters Based on Laser Engineered Surfaces

In systems experiencing high temperature load, especially those under vacuum, radiative heat transfer plays a significant role. The key material parameter in heat transfer by radiation is spectral emissivity. The ability to engineer radiative response in a wide spectral region is therefore of paramount importance for radiation cooling of high temperature systems. Thermal emission control can be achieved via modification of surface topography and is currently realised with photonic crystal structures that can be tuned to enhance emissivity in a particular spectral region [1] as well as textured metallic coatings for a broadband emissivity control [2]

Microchannel cooling for the LHCb VELO upgrade I

The LHCb VELO Upgrade I, currently being installed for the 2022 start of LHC Run 3, uses silicon microchannel coolers with internally circulating bi-phase for thermal control of hybrid pixel modules operating in vacuum. This is the largest scale application of this technology to date. Production of the microchannel coolers was completed in July 2019 and the assembly into cooling structures was completed in September 2021. This article describes the R&D path supporting the microchannel production and assembly and the motivation for the design choices, together with the achieved fluidic and thermal performance. The Thermal Figure of Merit of the microchannel coolers is measured on the final modules to be between 1.5 and 3.5 K cm W, depending on glue thickness. The microchannel coolers constitute 18% of the total radiation length of the VELO and less than 2% of the material seen before the second measured point on the tracks. Microchannel cooling is well suited to the VELO implementation due to the uniform mass distribution, close thermal expansion match with the module components and resistance to radiation