What is Scanning Probe Microscopy? And How Can It Be Used In Failure Analysis?

Scanning probe microscopy (SPM) techniques are not suitable as global defect-localization tools. They can, however, pinpoint the exact location of the defects once the approximate locations of the defects have been identified by other failure analysis techniques. SPM techniques also provide information such as 3-D topology, current, surface potential, and 2-D dopant profile that may not be readily obtainable with other techniques. This information, coupled with the unparalleled spatial resolution and high detection sensitivity can be used by failure analysts for root cause analysis

Backside localization of open and shorted IC interconnections

A new failure analysis technique has been developed for backside and frontside localization of open and shorted interconnections on ICs. This scanning optical microscopy technique takes advantage of the interactions between IC defects and localized heating using a focused infrared laser ({lambda} = 1,340 nm). Images are produced by monitoring the voltage changes across a constant current supply used to power the IC as the laser beam is scanned across the sample. The method utilizes the Seebeck Effect to localize open interconnections and Thermally-Induced Voltage Alteration (TIVA) to detects shorts. The interaction physics describing the signal generation process and several examples demonstrating the localization of opens and shorts are described. Operational guidelines and limitations are also discussed

Failure analysis for micro-electrical-mechanical systems (MEMS)

Micro-Electrical Mechanical Systems (MEMS) is an emerging technology with demonstrated potential for a wide range of applications including sensors and actuators for medical, industrial, consumer, military, automotive and instrumentation products. Failure analysis (FA) of MEMS is critically needed for the successful design, fabrication, performance analysis and reliability assurance of this new technology. Many devices have been examined using techniques developed for integrated circuit analysis, including optical inspection, scanning laser microscopy (SLM), scanning electron microscopy (SEM), focused ion beam (FIB) techniques, atomic force microscopy (AFM), infrared (IR) microscopy, light emission (LE) microscopy, acoustic microscopy and acoustic emission analysis. For example, the FIB was used to microsection microengines that developed poor performance characteristics. Subsequent SEM analysis clearly demonstrated the absence of wear on gear, hub, and pin joint bearing surfaces, contrary to expectations. Another example involved the use of infrared microscopy for thermal analysis of operating microengines. Hot spots were located, which did not involve the gear or hub, but indicated contact between comb structures which drive microengines. Voltage contrast imaging proved useful on static and operating MEMS in both the SEM and the FIB and identified electrostatic clamping as a potentially significant contributor to failure mechanisms in microengines. This work describes MEMS devices, FA techniques, failure modes, and examples of FA of MEMS

Linkage design effect on the reliability of surface-micromachined microengines driving a load

The reliability of microengines is a function of the design of the mechanical linkage used to connect the electrostatic actuator to the drive. The authors have completed a series of reliability stress tests on surface micromachined microengines driving an inertial load. In these experiments, the authors used microengines that had pin mechanisms with guides connecting the drive arms to the electrostatic actuators. Comparing this data to previous results using flexure linkages revealed that the pin linkage design was less reliable. The devices were stressed to failure at eight frequencies, both above and below the measured resonance frequency of the microengine. Significant amounts of wear debris were observed both around the hub and pin joint of the drive gear. Additionally, wear tracks were observed in the area where the moving shuttle rubbed against the guides of the pin linkage. At each frequency, they analyzed the statistical data yielding a lifetime (t{sub 50}) for median cycles to failure and {sigma}, the shape parameter of the distribution. A model was developed to describe the failure data based on fundamental wear mechanisms and forces exhibited in mechanical resonant systems. The comparison to the model will be discussed

The effect of frequency on the lifetime of a surface micromachined microengine driving a load

Experiments have been performed on surface micromachined microengines driving load gears to determine the effect of the rotation frequency on median cycles to failure. The authors did observe a frequency dependence and have developed a model based on fundamental wear mechanisms and forces exhibited in resonant mechanical systems. Stressing loaded microengines caused observable wear in the rotating joints and in a few instances led to fracture of the pin joint in the drive gear

Infrared light emission from semiconductor devices

We present results using near-infrared (NIR) cameras to study emission of common defect classes for integrated circuits. The cameras are based on a liquid nitrogen cooled HgCdTe imaging array with high quantum efficiency and very low read noise. The array was developed for infrared astronomy and has high quantum efficiency in the wavelength range from 0.8 to 2.5 {mu}m. For comparison, the same set of samples used to characterize the performance of the NIR camera were studied using a non-intensified, liquid-nitrogen-cooled, slow scan CCD camera (with a spectral range 400-1100 nm). Results show that the NIR camera images all of the defect classes studied here with much shorter integration times than the cooled CCD, suggesting that photon emission beyond 1 {mu}m is significantly stronger than at shorter wavelengths

Fluorescent microthermal imaging-theory and methodology for achieving high thermal resolution images

The fluorescent microthermal imaging technique (FMI) involves coating a sample surface with an inorganic-based thin film that, upon exposure to UV light, emits temperature-dependent fluorescence. FMI offers the ability to create thermal maps of integrated circuits with a thermal resolution theoretically limited to 1 m{degrees}C and a spatial resolution which is diffraction-limited to 0.3 {mu}m. Even though the fluorescent microthermal imaging (FMI) technique has been around for more than a decade, many factors that can significantly affect the thermal image quality have not been systematically studied and characterized. After a brief review of FMI theory, we will present our recent results demonstrating for the first time three important factors that have a dramatic impact on the thermal quality and sensitivity of FMI. First, the limitations imparted by photon shot noise and improvement in the signal-to-noise ratio realized through signal averaging will be discussed. Second, ultraviolet bleaching, an unavoidable problem with FMI as it currently is performed, will be characterized to identify ways to minimize its effect. Finally, the impact of film dilution on thermal sensitivity will be discussed

Fiscal Year 1999

Two new failure analysis techniques have been developed for backside and front side localization of open and shorted interconnections on ICs. These scanning optical microscopy techniques take advantage of the interactions between IC defects and localized heating using a focused infrared laser ({lambda} = 1,340 nm). Images are produced by monitoring the voltage changes across a constant current supply used to power the IC as the laser beam is scanned across the sample. The methods utilize the Seebeck Effect to localize open interconnections and Thermally-Induced Voltage Alteration (TIVA) to detect shorts. Initial investigations demonstrated the feasibility of TIVA and Seebeck Effect Imaging (SEI). Subsequent improvements have greatly increased the sensitivity of the TIVA/SEI system, reducing the acquisition times by more than 20X and localizing previously unobserved defects. The interaction physics describing the signal generation process and several examples demonstrating the localization of opens and shorts are described. Operational guidelines and limitations are also discussed. The system improvements, non-linear response of IC defects to heating, modeling of laser heating and examples using the improved system for failure analysis are presented

Nanoindentation: Toward the sensing of atomic interactions

The mechanical properties of surfaces of layered materials (highly oriented pyrolytic graphite, InSe, and GaSe) and single-crystal ionic materials (NaCl, KBr, and KCl) have been investigated at the nanometer scale by using nanoindentations produced with an atomic force microscope with ultrasharp tips. Special attention has been devoted to the elastic response of the materials before the onset of plastic yield. A new model based on an equivalent spring constant that takes into account the changes in in-plane interactions on nanoindentation is proposed. The results of this model are well correlated with those obtained by using the Debye model of solid vibrations