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18 research outputs found

Lead-free soldering: Materials science and solder joint reliability

Author: F. Song
J.G. Lee
Kejun Zeng
T.T. Mattila
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

FEM simulations for reliability assessment of component boards drop tested at various temperatures

Author: H. Xu
J. Li
Lai
Li
M. Paulasto
T.T. Mattila
Tee
Publication venue: 'Elsevier BV'
Publication date
Field of study

Failure Mechanisms and Crack Propagation Paths in Thermally Aged Pb-Free Solder Interconnects

Author: A. Sharif
D. Cavasin
D. Li
D.Q. Yu
D.Q. Yu
Eduardo Franco De Monlevade
H. Fredriksson
H.-T. Lee
K.-W. Moon
K.K. Hong
K.N. Subramanian
K.S. Kim
K.Y. Lee
L.L. Duan
T.T. Mattila
T.T. Mattila
W.C. Luo
W.H. Müller
Weiqun Peng
Y.-S. Lai
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

Impact of Thermal Cycling on Sn-Ag-Cu Solder Joints and Board-Level Drop Reliability

Author: A. Sharif
C.L. Yeh
D.Y.R. Chong
F. Gao
Faxing Che
H.K. Kim
J.H.L. Pang
J.H.L. Pang
John H. L. Pang
K. N. Tu
K. Zeng
K. Zeng
K.N. Tu
L.H. Xu
L.H. Xu
L.H. Xu
Luhua Xu
P.T. Vianco
S.J. Wang
T.T. Mattila
T.T. Mattila
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

Impact of printed wiring board coatings on the reliability of lead-free chip-scale package interconnections

Author: Bader
Bader
Cahn
Hirano
J.K. Kivilahti
Kang
Kivilahti
Koivisto
Lee
Leslie
Oberndorff
O’Connor
Peng
Puligandla
Sohn
Syed
T.T. Mattila
V. Vuorinen
Vianco
Zeng
Publication venue: 'Cambridge University Press (CUP)'
Publication date
Field of study

Failure Mechanisms of Thermomechanically Loaded SnAgCu/Plastic Core Solder Ball Composite Joints in Low-Temperature Co-Fired Ceramic/Printed Wiring Board Assemblies

Author: A. Prabhu
D.W. Hendersson
J. PUTAALA
J. VÄHÄKANGAS
J.E. Semmens
O. NOUSIAINEN
O. Nousiainen
R. RAUTIOAHO
S. Movva
S. Terashima
S. Terashima
T. KANGASVIERI
T.T. Mattila
Y. Qi
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

Metallurgical Factors Behind the Reliability of High-Density Lead-Free Interconnections

Author: A. Mitra
A.L. Titchener
B.A. Bilby
C. Thwaites
D. Frear
D.C. Montgomery
D.W. Henderson
F.J.J. Loo van
H. Mavoori
H. Yu
J. Haimovich
J.D. Verhoeven
J.K. Kivilahti
J.K. Kivilahti
J.S. Hunter
J.S. Hwang
J.S. Milton
K.-L. Lin
K.J. Rönkä
K.J. Rönkä
P. Lauro
P. Savolainen
P.D.T. O’Connor
R. Schetty
R.W. Cahn
S. Terashima
S. Terashima
T. Laurila
T. Laurila
T. Laurila
T.T. Mattila
T.T. Mattila
U.R. Kattner
V. Vuorinen
W.A. Tiller
W.C. Leslie
W.G. Bader
Z. Mei
Publication venue: 'Springer Science and Business Media LLC'
Publication date: 01/01/2007
Field of study

Issues related to the implementation of Pb-free electronic solders in consumer electronics

Author: D.R. Frear
D.R. Frear
D.R. Frear
D.R. Frear
D.R. Frear
D.R. Frear
H.K. Kim
J. Glazer
J. Glazer
J. Liang
J.J. Stephens
J.W. Nah
K. Mishiro
K.N. Tu
T.T. Mattila
V. Puligandla
W.J. Boettinger
Y.C. Hsu
Z. Mei
Publication venue: 'Springer Science and Business Media LLC'
Publication date: 01/01/2007
Field of study

Effect of Thermal Aging on Drop Performance of Chip Scale Packages with SnAgCu Solder Joints on Cu Pads

Author: D.Y.R. Chong
G. Ghosh
H.-T. Lee
J. Varghese
J.Y. Tsai
K. Zeng
K.-W. Moon
L. Garner
L. Snugovsky
M.E. Loomans
Marco Elisio Marques
P.T. Vianco
P.T. Vianco
T.T. Mattila
T.Y. Lee
Weiqun Peng
Y.S. Lai
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

Creep Behavior of Lead-Free Sn-Ag-Cu + Ni-Ge Solder Alloys

Author: C.M.L. Wu
F. Ochoa
H. Watanabe
I. Shoji
M. Kerr
M. Nagano
M. Nagano
M. Yoshiba
N. Hidaka
P.T. Vianco
Q. Xiao
R.J. Mccabe
S. Terashima
T.H. Chuang
T.T. Mattila
V.I. Igoshev
Y. Kariya
Z. Chen
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

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