200,247 research outputs found
Coherent State Control of Non-Interacting Quantum Entanglement
We exploit a novel approximation scheme to obtain a new and compact formula
for the parameters underlying coherent-state control of the evolution of a pair
of entangled two-level systems. It is appropriate for long times and for
relatively strong external quantum control via coherent state irradiation. We
take account of both discrete-state and continuous-variable degrees of freedom.
The formula predicts the relative heights of entanglement revivals and their
timing and duration.Comment: Published in PRA, 10 pages, 7 figure
Quantum transitions induced by the third cumulant of current fluctuations
We investigate the transitions induced by external current fluctuations on a
small probe quantum system. The rates for the transitions between the energy
states are calculated using the real-time Keldysh formalism for the density
matrix evolution. We especially detail the effects of the third cumulant of
current fluctuations inductively coupled to a quantum bit and propose a setup
for detecting the frequency-dependent third cumulant through the transitions it
induces.Comment: 4 pages, 3 figure
Modeling with structure of resins in electonic compornents
In recent years, interfacial fracture becomes one of the most important
problems in the assessment of reliability of electronics packaging. Especially,
underfill resin is used with solder joints in flip chip packaging for
preventing the thermal fatigue fracture in solder joints. In general, the
interfacial strength has been evaluated on the basis of interfacial fracture
mechanics concept. However, as the size of devices decrease, it is difficult to
evaluate the interfacial strength quantitatively. Most of researches in the
interfacial fracture were conducted on the basis of the assumption of the
perfectly bonding condition though the interface has the micro-scale structure
and the bonding is often imperfect. In this study, the mechanical model of the
interfacial structure of resin in electronic components was proposed.
Bimaterial model with the imperfect bonding condition was examined by using a
finite element analysis (FEA). Stress field in the vicinity of interface
depends on the interfacial structure with the imperfect bonding. In the front
of interfacial crack tip, the behavior of process zone is affected by
interfacial structure. However, the instability of fracture for macroscopic
crack which means the fracture toughness is governed by the stress intensity
factor based on the fracture mechanics concept.Comment: Submitted on behalf of TIMA Editions
(http://irevues.inist.fr/tima-editions
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