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28 research outputs found

Thermodynamic properties and microstructural characteristics of binary Ag-Sn alloys

Author: A E Kissavos
B Hülsen
BingBo Wei
D Yagodin
E Moukhina
F X Chen
H Terasaki
I Karakaya
I Shohji
J Buschbeck
J P Harvey
P K Ray
R Jia
S Curiotto
T Garnier
T Rouxel
V S Phung
Wei Zhai
Z M Wang
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

Analysis of Image Gently Abdominal CT Protocol With the Use of Body Phantom Adapted to the Japanese Size

Author: Ishiguchi T
Kazuki Kuriyama
Megumi Iijima
Nobutaka Yanano
Rika Goto
Tomokazu Shohji
Yo Kato
Publication venue: 'American Roentgen Ray Society'
Publication date
Field of study

Atomizing Effect on Sn-Zn Based Solder Alloy

Author: I. Shohji T. Nakamura, F. Mori and S. Fujiuchi
K. Teshima
KAMIYA YOSHIHISA
LIN K-L
SUGANUMA K
SUGANUMA K
Publication venue: 'Japan Institute of Metals'
Publication date: 01/01/2006
Field of study

AgIn2/Ag2In transformations in an In-49Sn/Ag soldered joint under thermal aging

Author: A.D. Romig
I. Shohji
J. Glazer
J.W. Morris
K. Shimizu
K.L. Lin
L. C. Tsao
N.C. Lee
S.K. Kang
T. H. Chuang
Y. T. Huang
Y.T. Huang
Z. Mei
Z. Mei
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads

Author: Albert T. Wu
B. Li
C.S. Hau-Riege
E.C.C. Yeh
H. Gan
H. Ye
I. Shohji
I.A. Blech
I.A. Blech
K. Suganuma
K.N. Tu
K.N. Tu
P.S. Ho
S.Z. Lin
T. Jantzen
T. Sugizaki
T.H. Chuang
T.L. Shao
T.Y. Lee
T.Y. Lee
W.H. Lin
W.J. Choi
Y.S. Kim
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

Maskierende Wirkung von Kaliumiodid auf Störungen bei der AAS-Bestimmung von Antimon durch Stibinerzeugung mit Hilfe der Natriumborhydridreduktion

Author: A. E. Smith
D. Pierce
H. S. Fleming
K. C. Thompson
M. Bedard
M. Fiser
M. Thompson
Manabu Yamamoto
R. Belcher
R. S. Braman
T. Kamada
T. Kamada
T. Kamada
T. Kamada
T. Kamada
Tadashi Shohji
Takahiro Kumamaru
Y. Yamamoto
Y. Yamamoto
Y. Yamamoto
Y. Yamamoto
Y. Yamamoto
Y. Yamamoto
Y. Yamamoto
Y. Yamamoto
Y. Yamamoto
Yuroku Yamamoto
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

Interfacial reaction between Sn-0.7Cu (-Ni) solder and Cu substrate

Author: C.E. Ho
C.H. Lin
C.M. Chuang
H.T. Lee
Hiroshi Nishikawa
I. Shohji
I.E. Anderson
J.H.L. Pang
J.Y. Tsai
Jin Yu Piao
K.S. Bae
M. Abtew
S.H. Huh
S.W. Chen
S.W. Chen
S.W. Chen
S.W. Chen
T. Takemoto
T. Takemoto
T. Takemoto
T. Takemoto
Tadashi Takemoto
W.K. Choi
W.T. Chen
X. Ma
Y.G. Lee
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

Morphology and Pull Strength of Sn-Ag(-Co) Solder Joint with Copper Pad

Author: Akira Komatsu
C.M. Chuang
C.M.T. Law
C.W. Hwang
D. Li
D.G. Kim
H. Nishikawa
Hiroshi Nishikawa
I. Shohji
I.E. Anderson
J.W. Yoon
J.Y. Tsai
K. Noguchi
K. Zeng
S.H. Huh
S.K. Kang
S.T. Kao
S.W. Chen
T. Takemoto
T. Takemoto
T. Takemoto
T.H. Chuang
Tadashi Takemoto
W.K. Choi
W.K. Choi
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

Effects of deposition conditions of Al and Ti underlayer on electromigration reliability for deep-submicron interconnect metallization

Author: B.H. Jung
B.J. Root
C. Ryu
C.K. Hu
C.K. Hu
D. W. Lee
D.B. Knorr
D.G. Pierce
H. H. Ryu
H. Wang
J. Proost
J.S. Byun
M.B. Small
R. Shohji
S. Vaidya
T. Itoh
T. Kouno
T.J. Licate
W. Lee
Y. B. Park
Y. Inoue
Y. Inoue
Publication venue: 'Springer Science and Business Media LLC'
Publication date
Field of study

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