Manufacturing process for high aspect ratio metallic micro parts made by electroplating on partially conductive templates

Extended Abstract In supporting structural integrity of a miniature component, or for providing electric conduction of a through-silicon via (TSV) in three-dimensional integrated circuits (3D-IC), micro-or nano-hole filling with metallic material becomes increasing important in various micro-electrical mechanical systems (MEMSs) In this study, an anodic aluminum oxide (AAO) template containing numerous high aspect ratio nano-sized holes (an average diameter of 130 nm and an aspect-ratio about 20) was used as the cathode. The hydrophobicity/hydrophilicity of the AAO template was adjusted before Cu electrodeposition. Electrodeposition of Cu was carried out in an emulsified sc-CO2 bath containing cupric sulfate aqueous solution as the precursor. Cu deposition into the nano-holes was performed at an apparent constant current density of 2 A/dm 2 for 5 minutes. After electrodeposition, the cross section morphology and chemical composition of the AAO cathode was examined by transmission electron microscopy (TEM) and energy dispersive spectroscopy (EDS) with the aid of a focused-ion-beam (FIB). The experimental results showed that electrodeposition employing sc-CO2 bath to fill Cu into nano-sized holes was successful and superior to that of conventional process carried out at ambient pressure, in terms of uniformity and deposition rate. The high solubility of hydrogen gas in sc-CO2 fluid is the key factor. Moreover, the advantage of sc-CO2 electrodeposition is more pronounced for the AAO cathode exhibiting hydrophobic nature with respect to aqueous bath. References [1] Z