Modeling induction machines for EMC-Analysis,"

Abstract-EMC-analysis of power electronic systems is strongly supported by network simulations. Simulations at the system level provide not only the prediction of EMI but also deep insight into the EMC relevant effects. To model the system properly, it is necessary to model source and target of EMI and also all parts of the coupling paths. EMI-filters can be designed efficiently using network based modeling approaches. In this paper a model for induction machines' EMC behaviour simulation is parameterized in the frequency range from some kHz up to 100 MHz. The high-frequency characteristics of induction machines with power ratings from 370 W up to 45 kW are compared and a model library is set up for both, frequency and time domain

Überwachungssystem für eine Vielzahl von Objekten

The invention relates to a monitoring system (1) for a plurality of objects (2), which are at risk for damage due to external influences, wherein for each object (2), the monitoring system (1) comprises at least one sensor unit (3) attached to the object (2) for generating measurement signals as a function of at least one measured value characterizing a damaging effect on the respective object (2). The system (1) further comprises an evaluation unit (4) for evaluating the measurement signals. According to the invention, the evaluation unit (4) is programmatically configured such that for each object, at least one stress value is derived from a progression over time of the at least one measured value, a conservational model associated with said object (2) for a current value of said stress value(s) is evaluated, and the value of at least one parameter is derived therefrom, which presents a measure for a conservational condition of said object (2), or a change in the conservational condition of said object (2)

Electrical modeling of the power delivery to an LED array packaged in a textile

Recent technologies enable large arrays of LEDs to be integrated into textiles, which has applications in the lighting industry. Two analytical modeling techniques are proposed that calculate the supply power at a source necessary to provide the LED drivers with a minimum voltage. The modeling techniques show a correlation with numerical simulations to within 10% but can be implemented for very large LED arrays where, for time constraints, numerical simulations become impractical. The modeling allows a designer to optimize the location of the supply voltage, which can reduce the increase in voltage over the ideal voltage by 40%

Design and Evaluation of Feedforward Active Ripple Filters

An active ripple filter is an electronic circuit that cancels or suppresses the ripple current and electromagnetic interference generated by the power stage of a power converter, thus reducing the passive filtration requirements. This paper explores the design of feedforward active ripple filters for current ripple cancellation, including the design tradeoffs, advantages, and limitations of different implementation methods. The design and performance of an active filter using a novel Rogowski-coil current sensor is discussed in detail. Experimental results from a prototype converter system using this approach are presented, and quantitative comparisons are made between a hybrid passive/active filter and a purely passive filter. It is demonstrated that substantial improvements in filter mass and converter transient performance are achievable using this active ripple filtering method.United States. Office of Naval Research (Grant N00014-96-1-0524)United States. Office of Naval Research (Grant N00014-00-1-0381)MIT/Industry Consortium on Advanced Automotive Electrical/Electronic Components and System

Design and Comparison of 24 GHz Patch Antennas on Glass Substrates for Compact Wireless Sensor Nodes

Three patch antennas suitable for integration and operation in a compact 24 GHz wireless sensor node with radar and communication functions are designed, characterized, and compared. The antennas are manufactured on a low loss glass wafer using thin film (BCB/Cu) wafer level processing (WLP) technologies. This process is well suited for 3D stacking. The antennas are fed through a microstrip line underneath a ground plane coupling into the patch resonator through a slot aperture. Linear polarization (LP), dual mode (DM) operation, and circular polarization (CP) are achieved through the layout of the slot aperture and rectangular patch dimensions. Antenna gain values of ∼5.5 dBi are obtained in addition to the 10 dB impedance bandwidths of 900 MHz and 1.3 GHz as well as 500 MHz CP bandwidth with a 3 dB axial ratio for the LP, DM, and CP patch antennas, respectively