4 research outputs found

    BDAQ53, a versatile pixel detector readout and test system for the ATLAS and CMS HL-LHC upgrades

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    BDAQ53 is a readout system and verification framework for hybrid pixel detector readout chips of the RD53 family. These chips are designed for the upgrade of the inner tracking detectors of the ATLAS and CMS experiments. BDAQ53 is used in applications where versatility and rapid customization are required, such as in laboratory testing environments, test beam campaigns, and permanent setups for quality control measurements. It consists of custom and commercial hardware, a Python-based software framework, and FPGA firmware. BDAQ53 is developed as open source software with both software and firmware being hosted in a public repository.Comment: 6 pages, 6 figure

    Characterization of the Joined ATLAS and CMS RD53A Pixel Chip

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    This thesis aims to give a performance overview of the RD53A Hybrid pixel detector readout chip. The chip is manufactured in 65nm CMOS technology and the first large scale prototype for future chips incorporated into the pixel detectors of ATLAS and CMS. The chip has been tested bare with regards to its digital and analog performance. In addition to that the effect of different data acquisition systems on chip performance has been studied

    RD53B Wafer Testing for the ATLAS ITk Pixel Detector

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    RD53 is the research and development group at CERN responsible for developing and producing the next generation of readout chips for the ATLAS and CMS pixel detectors at the HL-LHC. Its most recent development ITkPix/RD53B is the rst full-scale 65 nm hybrid pixel-readout chip. ITkPix consists of more than one billion transistors with high memory triplication ratio in order to cope with the high particle density at the heart of ATLAS. The chips will be located as close as possible to the interaction point to optimize impact parameter resolution. The ITkPix chip features a 5Gbit connection, with special data compression to deal with high hit intensities. In addition to that, a low power, low noise analog front-end is used, to ensure high readout speeds and low detection thresholds. A failure of chips at the heart of ATLAS is problematic. Therefore, thorough testing before and during production is necessary. For this purpose, Bonn has developed BDAQ53, a fast and versatile simulation and testing environment, allowing for small-and large-scale testing for ITkPix and its successor chips. This conference note will give an overview over the testing environment, while focusing on large-scale wafer testing to evaluate ITkPix's tness for its deployment at the HL-LHC

    RD53 Wafer Testing for the ATLAS ITk Pixel Detector

    No full text
    RD53 is the research and development group at CERN, responsible for developing and producing the next generation of readout chips for the ATLAS and CMS pixel detector upgrades at the HL-LHC. Its most recent development ITkPix is the first full-scale 65 nm hybrid pixel-detector. ITkPix consists of more than one billion transistors with a high triplication ratio in order to cope with the high particle and therefore radiation density at the heart of ATLAS. The chips will be located as close as possible to the interaction point to optimize impact parameter resolution. The ITkPix chip features a 5Gbit connection, with special data compression to deal with high hit intensities. In addition to that, a low power, low noise analog front-end is used, to ensure high readout speeds and low detection thresholds. A failure of chips at the heart of ATLAS is problematic. Therefore, thorough testing before and duringtheproduction phase is necessary. For thispurpose, Bonn has developed bdaq, a fast and versatile simulation, testing and analysis environment, making small-and large-scale testing for ITkPix and its successors possible. This talk will give an overview over the testing environment, while focusing on large scale wafer testing results to evaluatetheITkPix fitness for its deployment at the HL-LHC
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