Fluidic packaging of microengine and microrocket devices for high pressure and high temperature operation

The fluidic packaging of Power MEMS devices such as the MIT microengine and microrocket requires the fabrication of hermetic seals capable of withstanding temperature in the range 20-600/spl deg/C and pressures in the range 100-300 atm. We describe an approach to such packaging by attaching Kovar metal tubes to a silicon device using glass seal technology. Failure due to fracture of the seals is a significant reliability concern in the baseline process: microscopy revealed a large number of voids in the glass, pre-cracks in the glass and silicon, and poor wetting of the glass to silicon. The effects of various processing and materials parameters on these phenomena were examined. A robust procedure, based on the use of metal-coated silicon substrates, was developed to ensure good wetting. The bending strength of single-tube specimens was determined at several temperatures. The dominant failure mode changed from fracture at room temperature to yielding of the glass and Kovar at 600/spl deg/C. The strength in tension at room temperature was analyzed using Weibull statistics; these results indicate a probability of survival of 0.99 at an operational pressure of 125 atm at room temperature for single tubes and a corresponding probability of 0.9 for a packaged device with 11 joints. The residual stresses were analyzed using the method of finite elements and recommendations for the improvement of packaging reliability are suggested

Materials selection in micromechanical design: an application of the Ashby approach

The set of materials available to microsystems designers is rapidly expanding. Techniques now exist to introduce and integrate a large number of metals, alloys, ceramics, glasses, polymers, and elastomers into microsystems, motivating the need for a rational approach for materials selection in microsystems design. As a step toward such an approach, we focus on the initial stages of materials selection for micromechanical structures with minimum feature sizes greater than 1 /spl mu/m. The variation of mechanical properties with length scale and processing parameters is discussed. Bounds for initial design values of several properties are suggested and the necessity for the measurement of other properties (especially residual stresses and intrinsic loss coefficients) is discussed. Adapting the methods pioneered by Ashby et al., materials indices are formulated for a number of properties and materials selection charts are presented. These concepts are applied to illustrate initial materials selection for shock-resistant microbeams, force sensors, micromechanical filters, and micromachined flexures. Issues associated with the integration of materials into microsystems are briefly discussed

Micro-Raman measurement of bending stresses in micromachined silicon flexures

Micron-scale characterization of mechanical stresses is essential for the successful design and operation of many micromachined devices. Here we report the use of Raman spectroscopy to measure the bending stresses in deep reactive-ion etched silicon flexures with a stress resolution of /spl sim/10 MPa and spatial resolution of /spl sim/1 /spl mu/m. The accuracy of the technique, as assessed by comparison to analytical and finite-element models of the deformation, is conservatively estimated to be 25 MPa. Implications for the use of this technique in microsystems design are discussed

Structural design considerations for micromachined solid oxide fuel cells

Micromachined solid-oxide fuel cells (?SOFCs) are among a class of devices being investigated for portable power generation. Optimization of the performance and reliability of such devices requires robust, scale-dependent, design methodologies. In this first analysis, we consider the structural design of planar, electrolyte-supported, ?SOFCs from the viewpoints of electrochemical performance, mechanical stability and reliability, and thermal behavior. The effect of electrolyte thickness on fuel cell performance is evaluated using a simple analytical model. Design diagrams that account explicitly for thermal and intrinsic residual stresses are presented to identify geometries that are resistant to fracture and buckling. Analysis of energy loss due to in-plane heat conduction highlights the importance of efficient thermal isolation in microscale fuel cell design

A critical review of microscale mechanical testing methods used in the design of microelectromechanical systems

Microelectromechanical systems (MEMS) technologies are evolving at a rapid rate with increasing activity in the design, fabrication, and commercialization of a wide variety of microscale systems and devices. The importance of accurate mechanical property measurement for successful design was realized early on in the development of this field. Consequently, there exist many different techniques to measure quantities such as the Young’s modulus (E), yield strength (sY), fracture strength (sF), residual stress (sR),and residual stress gradient (. sR) of microscale structures and materials. We review and critically compare several of the important techniques including the microtension test, axisymmetric plate bend test, microbeam bend test, M-test, wafer curvature measurements, dynamic (resonant) tests, fabrication of passive strain sensors, and Raman spectroscopy. We discuss the characteristics of typical test structures, and the common sources of structure-related errors in measurement. A rational approach for the selection of test techniques for the design of microsystems is suggested