Characteristics of GaAsSb single quantum well lasers emitting near 1.3 {micro}m

The authors report data on GaAsSb single quantum well lasers grown on GaAs substrates. Room temperature pulsed emission at 1.275 {micro}m in a 1,250 {micro}m-long device has been observed. Minimum threshold current densities of 535 A/cm{sup 2} were measured in 2000 {micro}m long lasers. The authors also measured internal losses of 2--5 cm{sup {minus}1}, internal quantum efficiencies of 30-38% and characteristic temperature T{sub 0} of 67--77 C. From these parameters a gain constant G{sub 0} of 1,660 cm{sup {minus}1} and a transparency current density J{sub tr} of 134 A/cm{sup 2} were calculated. The results indicate the potential for fabricating 1.3 {micro}m VCSELs from these materials

A comprehensive approach to decipher biological computation to achieve next generation high-performance exascale computing.

The human brain (volume=1200cm3) consumes 20W and is capable of performing>10%5E16 operations/s. Current supercomputer technology has reached 1015 operations/s, yet it requires 1500m%5E3 and 3MW, giving the brain a 10%5E12 advantage in operations/s/W/cm%5E3. Thus, to reach exascale computation, two achievements are required: 1) improved understanding of computation in biological tissue, and 2) a paradigm shift towards neuromorphic computing where hardware circuits mimic properties of neural tissue. To address 1), we will interrogate corticostriatal networks in mouse brain tissue slices, specifically with regard to their frequency filtering capabilities as a function of input stimulus. To address 2), we will instantiate biological computing characteristics such as multi-bit storage into hardware devices with future computational and memory applications. Resistive memory devices will be modeled, designed, and fabricated in the MESA facility in consultation with our internal and external collaborators

Highly-Efficient Buried-Oxide-Waveguide Laser by Selective Oxidation

An edge-emitting buried-oxide waveguide (BOW) laser structure employing lateral selective oxidation of AlGaAs layers above and below the active region for waveguiding and current confinement is presented. This laser configuration has the potential for very small lateral optical mode size and high current confinement and is well suited for integrated optics applications where threshold current and overall efficiency are paramount. Optimization of the waveguide design, oxide layer placement, and bi-parabolic grading of the heterointerfaces on both sides of the AlGaAs oxidation layers has yielded 95% external differential quantum efficiency and 40% wall-plug efficiency from a laser that is very simple to fabricate and does not require epitaxial regrowth of any kind

Fiscal Year 1999

This project represented a coordinated LLNL-SNL collaboration to investigate the feasibility of developing radiation-hardened magnetic non-volatile memories using giant magnetoresistance (GMR) materials. The intent of this limited-duration study was to investigate whether giant magnetoresistance (GMR) materials similar to those used for magnetic tunnel junctions (MTJs) were process compatible with functioning CMOS circuits. Sandia's work on this project demonstrated that deposition of GMR materials did not affect the operation nor the radiation hardness of Sandia's rad-hard CMOS technology, nor did the integration of GMR materials and exposure to ionizing radiation affect the magnetic properties of the GMR films. Thus, following deposition of GMR films on rad-hard integrated circuits, both the circuits and the films survived ionizing radiation levels consistent with DOE mission requirements. Furthermore, Sandia developed techniques to pattern deposited GMR films without degrading the completed integrated circuits upon which they were deposited. The present feasibility study demonstrated all the necessary processing elements to allow fabrication of the non-volatile memory elements onto an existing CMOS chip, and even allow the use of embedded (on-chip) non-volatile memories for system-on-a-chip applications, even in demanding radiation environments. However, funding agencies DTRA, AIM, and DARPA did not have any funds available to support the required follow-on technology development projects that would have been required to develop functioning prototype circuits, nor were such funds available from LDRD nor from other DOE program funds

High Speed 2D Hadamard Transform Spectral Imager

Hadamard Transform Spectrometer (HTS) approaches share the multiplexing advantages found in Fourier transform spectrometers. Interest in Hadamard systems has been limited due to data storage/computational limitations and the inability to perform accurate high order masking in a reasonable amount of time. Advances in digital micro-mirror array (DMA) technology have opened the door to implementing an HTS for a variety of applications including fluorescent microscope imaging and Raman imaging. A Hadamard transform spectral imager (HTSI) for remote sensing offers a variety of unique capabilities in one package such as variable spectral and temporal resolution, no moving parts (other than the micro-mirrors) and vibration tolerance. Two approaches to for 2D HTS systems have been investigated in this LDRD. The first approach involves dispersing the incident light, encoding the dispersed light then recombining the light. This method is referred to as spectral encoding. The other method encodes the incident light then disperses the encoded light. The second technique is called spatial encoding. After creating optical designs for both methods the spatial encoding method was selected as the method that would be implemented because the optical design was less costly to implement

Fabrication of Diffractive Optical Elements for an Integrated Compact Optical-MEMS Laser Scanner

The authors describe the microfabrication of a multi-level diffractive optical element (DOE) onto a micro-electromechanical system (MEMS) as a key element in an integrated compact optical-MEMS laser scanner. The DOE is a four-level off-axis microlens fabricated onto a movable polysilicon shuttle. The microlens is patterned by electron beam lithography and etched by reactive ion beam etching. The DOE was fabricated on two generations of MEMS components. The first generation design uses a shuttle suspended on springs and displaced by a linear rack. The second generation design uses a shuttle guided by roller bearings and driven by a single reciprocating gear. Both the linear rack and the reciprocating gear are driven by a microengine assembly. The compact design is based on mounting the MEMS module and a vertical cavity surface emitting laser (VCSEL) onto a fused silica substrate that contains the rest of the optical system. The estimated scan range of the system is {+-}4{degree} with a spot size of 0.5 mm

Integration of Optoelectronics and MEMS by Free-Space Micro-optics

This report represents the completion of a three-year Laboratory-Directed Research and Development (LDRD) program to investigate combining microelectromechanical systems (MEMS) with optoelectronic components as a means of realizing compact optomechanical subsystems. Some examples of possible applications are laser beam scanning, switching and routing and active focusing, spectral filtering or shuttering of optical sources. The two technologies use dissimilar materials with significant compatibility problems for a common process line. This project emphasized a hybrid approach to integrating optoelectronics and MEMS. Significant progress was made in developing processing capabilities for adding optical function to MEMS components, such as metal mirror coatings and through-vias in the substrate. These processes were used to demonstrate two integration examples, a MEMS discriminator driven by laser illuminated photovoltaic cells and a MEMS shutter or chopper. Another major difficulty with direct integration is providing the optical path for the MEMS components to interact with the light . We explored using folded optical paths in a transparent substrate to provide the interconnection route between the components of the system. The components can be surface-mounted by flip-chip bonding to the substrate. Micro-optics can be fabricated into the substrate to reflect and refocus the light so that it can propagate from one device to another and them be directed out of the substrate into free space. The MEMS components do not require the development of transparent optics and can be completely compatible with the current 5-level polysilicon process. We report progress on a MEMS-based laser scanner using these concepts

GaAs MOEMS Technology

Many MEMS-based components require optical monitoring techniques using optoelectronic devices for converting mechanical position information into useful electronic signals. While the constituent piece-parts of such hybrid opto-MEMS components can be separately optimized, the resulting component performance, size, ruggedness and cost are substantially compromised due to assembly and packaging limitations. GaAs MOEMS offers the possibility of monolithically integrating high-performance optoelectronics with simple mechanical structures built in very low-stress epitaxial layers with a resulting component performance determined only by GaAs microfabrication technology limitations. GaAs MOEMS implicitly integrates the capability for radiation-hardened optical communications into the MEMS sensor or actuator component, a vital step towards rugged integrated autonomous microsystems that sense, act, and communicate. This project establishes a new foundational technology that monolithically combines GaAs optoelectronics with simple mechanics. Critical process issues addressed include selectivity, electrochemical characteristics, and anisotropy of the release chemistry, and post-release drying and coating processes. Several types of devices incorporating this novel technology are demonstrated

Selective Oxidation Technology and its Applications Toward Electronic and Optoelectronic Devices

Selective oxidation of AlGaAs compounds has facilitated dramatic improvements in the performance of near IR VCSELS. Under the auspices of this proposal we have: (1) expanded our understanding of both the strengths and the limitations of this technology; (2) explored its applicability to other Al bearing materials; (3) utilized this technology base to demonstrate a variety of new electronic and optoelectronic devices; and (4) established the reliability and manufacturability of oxidized devices such as VCSELS. Specifically, we have investigated conditions required to maximize control of the oxidation process as well as those required to facilitate inhibit etching of the resultant oxide. Concurrently, studies were performed to extend the technology to other Al-bearing compounds such as Al(Ga)AsSb, InAl(Ga)P and Al(Ga)N. Several new devices utilizing the selective oxidation technology of AlGaAs, as well as Al(Ga)AsSb were be considered. On a separate front, we also explored the possibility of using oxidized AlGaAs and InAl(Ga)P to form GaAs/AIGaAs FETs. Finally, reliability and manufacturability issues of the high performance VCSELS fabricated using selective oxidation technology, were addressed