4 research outputs found

    Single-step, spin-on process for high fidelity and selective deposition

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    Processes that enable selective deposition in thin films are desired for advanced patterning applications to reduce overlay demands, but conventional techniques are slow and limited in material scope. Here, we report a method that selectively deposits polymeric coatings on heterogeneous substrates (Cu/SiO2) using spin coating. Unlike traditional approaches that rely on surface pretreatments, herein, selectivity is induced by polymer design that promotes preferential dewetting from one substrate material and uniform wetting on the other. As evidenced by studies with homogeneous surfaces, poly(acrylates) containing semifluorinated pendant groups satisfy this criterion and spontaneously dewet from SiO2 but form continuous films on Cu. When spin coated onto Cu/SiO2 lineā€“space patterns, these semifluorinated polymers selectively coat only the Cu lines without any pre- or postprocessing. Rational design rules have been elucidated that anticipate regimes of selective deposition by correlating the droplet size of dewetted features on homogeneous SiO2 with the dimensions of heterogeneous Cu/SiO2 patterns. The universality of this unique strategy is demonstrated across a library of polymers with varying molecular weights and monomer structures, providing significant advances arising from the simplicity and rapidity of spin coating. For 10ā€“40 Ī¼m full pitch features, the entire deposition procedure involves a single step and is complete in under 1 min

    Rapid and selective deposition of patterned thin films on heterogeneous substrates via spin coating

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    The selective deposition of polymer thin films can be achieved via spin coating by manipulating interfacial interactions. While this "spin dewetting" approach sometimes generates spatial localization on topographic and chemical patterns, the connection between material selection, process parameters, and resulting film characteristics remains poorly understood. Here, we demonstrate that accurate control over these parameters allows incomplete trichlorosilane self-assembled monolayers (SAMs) to induce spin dewetting on both homogeneous (SiO) and heterogeneous (Cu/SiO or TiN/SiO) surfaces. Glassy polymers undergo a sharp transition from uniform wetting to complete dewetting depending on spin speed, solution concentration, polymer molecular weight, and SAM chemistry. Under optimal conditions, spin dewetting on line-space patterns results in the selective deposition of polymer over regions not functionalized with SAM. The insights described herein clarify the importance of different variables involved in spin dewetting and provide access to a versatile strategy for patterning polymeric thin films
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