OPTIMIZATION OF ALBENDAZOLE 400 MG TABLET COMPRESSION PROCESS USING DESIGN OF EXPERIMENT (DOE) APPROACH

Objective: The present study aims to model and optimize the compression process of the Albendazole 400 mg tablets of a pharmaceutical industry production line to increase the production speed (tablets/h) while maintaining quality requirements. Methods: The study was conducted using the Design of Experiments (DoE) methodology to identify and correlate the critical parameters during the process that affect the maintenance of the compression speed. In order to support the experiments, was tested disintegration time, average hardness, hardness variation, average weight, and friability. Results: Was obtained that quality attributes of disintegration and friability did not generate a significant model but it has been established correlations between Fill-O-Matic speed and main compression force in the responses of weight variation, hardness, and mean hardness. It was found that the main compression force between 6 to 9 kN, the pre-compression force of 1,965 to 5,615 kN, and the speed of 55 RPM for Fill-O-Matic speed are responsible for ensuring that all quality attributes analyzed remain within the expected specification. Conclusion: It was possible to apply the Design of Experiment (DoE) methodology in the compression process of the drug Albendazole 400 mg and to evaluate the impact of the parameters of this step on the formation of the tablet to significantly increasing the productivity of this product. The Fill-O-Matic speed parameter was the main control factor discovered in this study to maintain quality attributes

Tensile behaviour of a structural adhesive at high temperatures by the extended finite element method

Component joining is typically performed by welding, fastening, or adhesive-bonding. For bonded aerospace applications, adhesives must withstand high-temperatures (200°C or above, depending on the application), which implies their mechanical characterization under identical conditions. The extended finite element method (XFEM) is an enhancement of the finite element method (FEM) that can be used for the strength prediction of bonded structures. This work proposes and validates damage laws for a thin layer of an epoxy adhesive at room temperature (RT), 100, 150, and 200°C using the XFEM. The fracture toughness (G Ic ) and maximum load ( ); in pure tensile loading were defined by testing double-cantilever beam (DCB) and bulk tensile specimens, respectively, which permitted building the damage laws for each temperature. The bulk test results revealed that decreased gradually with the temperature. On the other hand, the value of G Ic of the adhesive, extracted from the DCB data, was shown to be relatively insensitive to temperature up to the glass transition temperature (T g ), while above T g (at 200°C) a great reduction took place. The output of the DCB numerical simulations for the various temperatures showed a good agreement with the experimental results, which validated the obtained data for strength prediction of bonded joints in tension. By the obtained results, the XFEM proved to be an alternative for the accurate strength prediction of bonded structures

On-demand generation of background--free single photons from a solid-state source

True on--demand high--repetition--rate single--photon sources are highly sought after for quantum information processing applications. However, any coherently driven two-level quantum system suffers from a finite re-excitation probability under pulsed excitation, causing undesirable multi--photon emission. Here, we present a solid--state source of on--demand single photons yielding a raw second--order coherence of $g^{(2)}(0)=(7.5\pm1.6)\times10^{-5}$ without any background subtraction nor data processing. To this date, this is the lowest value of $g^{(2)}(0)$ reported for any single--photon source even compared to the previously best background subtracted values. We achieve this result on GaAs/AlGaAs quantum dots embedded in a low--Q planar cavity by employing (i) a two--photon excitation process and (ii) a filtering and detection setup featuring two superconducting single--photon detectors with ultralow dark-count rates of $(0.0056\pm0.0007) s^{-1}$ and $(0.017\pm0.001) s^{-1}$, respectively. Re--excitation processes are dramatically suppressed by (i), while (ii) removes false coincidences resulting in a negligibly low noise floor

Association Studies and Legume Synteny Reveal Haplotypes Determining Seed Size in Vigna unguiculata.

Highly specific seed market classes for cowpea and other grain legumes exist because grain is most commonly cooked and consumed whole. Size, shape, color, and texture are critical features of these market classes and breeders target development of cultivars for market acceptance. Resistance to biotic and abiotic stresses that are absent from elite breeding material are often introgressed through crosses to landraces or wild relatives. When crosses are made between parents with different grain quality characteristics, recovery of progeny with acceptable or enhanced grain quality is problematic. Thus genetic markers for grain quality traits can help in pyramiding genes needed for specific market classes. Allelic variation dictating the inheritance of seed size can be tagged and used to assist the selection of large seeded lines. In this work we applied 1,536-plex SNP genotyping and knowledge of legume synteny to characterize regions of the cowpea genome associated with seed size. These marker-trait associations will enable breeders to use marker-based selection approaches to increase the frequency of progeny with large seed. For 804 individuals derived from eight bi-parental populations, QTL analysis was used to identify markers linked to 10 trait determinants. In addition, the population structure of 171 samples from the USDA core collection was identified and incorporated into a genome-wide association study which supported more than half of the trait-associated regions important in the bi-parental populations. Seven of the total 10 QTLs were supported based on synteny to seed size associated regions identified in the related legume soybean. In addition to delivering markers linked to major trait determinants in the context of modern breeding, we provide an analysis of the diversity of the USDA core collection of cowpea to identify genepools, migrants, admixture, and duplicates

Modelling adhesive joints with cohesive zone models: effect of the cohesive law shape of the adhesive layer

Adhesively-bonded joints are extensively used in several fields of engineering. Cohesive Zone Models (CZM) have been used for the strength prediction of adhesive joints, as an add-in to Finite Element (FE) analyses that allows simulation of damage growth, by consideration of energetic principles. A useful feature of CZM is that different shapes can be developed for the cohesive laws, depending on the nature of the material or interface to be simulated, allowing an accurate strength prediction. This work studies the influence of the CZM shape (triangular, exponential or trapezoidal) used to model a thin adhesive layer in single-lap adhesive joints, for an estimation of its influence on the strength prediction under different material conditions. By performing this study, guidelines are provided on the possibility to use a CZM shape that may not be the most suited for a particular adhesive, but that may be more straightforward to use/implement and have less convergence problems (e.g. triangular shaped CZM), thus attaining the solution faster. The overall results showed that joints bonded with ductile adhesives are highly influenced by the CZM shape, and that the trapezoidal shape fits best the experimental data. Moreover, the smaller is the overlap length (LO), the greater is the influence of the CZM shape. On the other hand, the influence of the CZM shape can be neglected when using brittle adhesives, without compromising too much the accuracy of the strength predictions

MicroRNAs in Ewing's Sarcoma

Les tumeurs de la famille du sarcome d'Ewing (ESFTs) sont les deuxièmes plus fréquentes formes de cancer de l'os chez l'enfant et l'adolescent. Le gène de fusion EWS-FLI1 est associé à 85-90% des ESFTs. Ce cancer a probablement pour origine des cellules souches mésenchymateuses (MSCs). Il a en effet été démontré que les MSCs pédiatriques (hpMSCs) sont particulièrement permissives pour le gène de fusion EWS-FLI1 et que celui-ci induit des gènes de cellules souches embryonnaires. Ceci génère une sous-population de cellules présentant des caractéristiques de cellules souches cancéreuses de sarcome d'Ewing (ESFT CSCs) in vitro. Ces cellules reprogrammées n'ont pas de potentiel tumorigénique et un certain nombre de microARN ne sont pas réprimés ou exprimés comme dans un sarcome d'Ewing primaire et sa sous-population de CSCs. Parmi ces microARN on trouve en particulier les membres de la famille let-7 qui jouent un rôle clé dans le contrôle de l'état de différenciation des cellules et régulent de nombreux oncogènes. De plus, leur répression serait capable de favoriser la tumorigénèse. Tous les membres de la famille des microARNs let-7 ont un régulateur commun, la protéine lin-28, qui exerce notamment son action en bloquant la maturation de ces microARNs. Dans ce travail, il s'agira d'évaluer si la co-expression de EWS-FLI1 et de lin-28 dans des hpMSCs permet de créer une sous-population de cellules présentant les caractéristiques de ESFT CSCs. Nous évaluerons l'effet de lin-28 sur les membres de la famille des let7 dans les hpMSCs et apprécierons le potentiel tumorigénique in vivo des hpMSCs exprimant EWS-FLI1 et lin-28. L'outil « Targetscan » est un logiciel qui permet de prédire les cibles des microARN en analysant leur séquence et en la comparant à l'ARN messager 3' non transcrit. Pour les microARN de la famille des let-7, cet outil identifie des gènes cibles potentiels qui jouent un rôle important dans le sarcome d'Ewing. Nous évaluerons si ces protéines sont en effet régulées de façon let-7 dépendante et les conséquences sur la pathogénèse des ESFTs

Strength improvement of adhesively-bonded joints using a reverse-bent geometry

Adhesive bonding of components has become more efficient in recent years due to the developments in adhesive technology, which has resulted in higher peel and shear strengths, and also in allowable ductility up to failure. As a result, fastening and riveting methods are being progressively replaced by adhesive bonding, allowing a big step towards stronger and lighter unions. However, single-lap bonded joints still generate substantial peel and shear stress concentrations at the overlap edges that can be harmful to the structure, especially when using brittle adhesives that do not allow plasticization in these regions. In this work, a numerical and experimental study is performed to evaluate the feasibility of bending the adherends at the ends of the overlap for the strength improvement of single-lap aluminium joints bonded with a brittle and a ductile adhesive. Different combinations of joint eccentricity were tested, including absence of eccentricity, allowing the optimization of the joint. A Finite Element stress and failure analysis in ABAQUS® was also carried out to provide a better understanding of the bent configuration. Results showed a major advantage of using the proposed modification for the brittle adhesive, but the joints with the ductile adhesive were not much affected by the bending technique

Resonance fluorescence of GaAs quantum dots with near-unity photon indistinguishability

Photonic quantum technologies call for scalable quantum light sources that can be integrated, while providing the end user with single and entangled photons on-demand. One promising candidate are strain free GaAs/AlGaAs quantum dots obtained by droplet etching. Such quantum dots exhibit ultra low multi-photon probability and an unprecedented degree of photon pair entanglement. However, different to commonly studied InGaAs/GaAs quantum dots obtained by the Stranski-Krastanow mode, photons with a near-unity indistinguishability from these quantum emitters have proven to be elusive so far. Here, we show on-demand generation of near-unity indistinguishable photons from these quantum emitters by exploring pulsed resonance fluorescence. Given the short intrinsic lifetime of excitons confined in the GaAs quantum dots, we show single photon indistinguishability with a raw visibility of $V_{raw}=(94.2\pm5.2)\,\%$, without the need for Purcell enhancement. Our results represent a milestone in the advance of GaAs quantum dots by demonstrating the final missing property standing in the way of using these emitters as a key component in quantum communication applications, e.g. as an entangled source for quantum repeater architectures

Adherend thickness effect on the tensile fracture toughness of a structural adhesive using an optical data acquisition method

Adhesive bonding is nowadays a serious candidate to replace methods such as fastening or riveting, because of attractive mechanical properties. As a result, adhesives are being increasingly used in industries such as the automotive, aerospace and construction. Thus, it is highly important to predict the strength of bonded joints to assess the feasibility of joining during the fabrication process of components (e.g. due to complex geometries) or for repairing purposes. This work studies the tensile behaviour of adhesive joints between aluminium adherends considering different values of adherend thickness (h) and the double-cantilever beam (DCB) test. The experimental work consists of the definition of the tensile fracture toughness (GIC) for the different joint configurations. A conventional fracture characterization method was used, together with a J-integral approach, that take into account the plasticity effects occurring in the adhesive layer. An optical measurement method is used for the evaluation of crack tip opening and adherends rotation at the crack tip during the test, supported by a Matlab® sub-routine for the automated extraction of these quantities. As output of this work, a comparative evaluation between bonded systems with different values of adherend thickness is carried out and complete fracture data is provided in tension for the subsequent strength prediction of joints with identical conditions