3,847 research outputs found

    Depreciation and Retirement Problems of Utilities

    Get PDF

    MalStone: Towards A Benchmark for Analytics on Large Data Clouds

    Full text link
    Developing data mining algorithms that are suitable for cloud computing platforms is currently an active area of research, as is developing cloud computing platforms appropriate for data mining. Currently, the most common benchmark for cloud computing is the Terasort (and related) benchmarks. Although the Terasort Benchmark is quite useful, it was not designed for data mining per se. In this paper, we introduce a benchmark called MalStone that is specifically designed to measure the performance of cloud computing middleware that supports the type of data intensive computing common when building data mining models. We also introduce MalGen, which is a utility for generating data on clouds that can be used with MalStone

    Piecewise smooth systems near a co-dimension 2 discontinuity manifold: can one say what should happen?

    Full text link
    We consider a piecewise smooth system in the neighborhood of a co-dimension 2 discontinuity manifold Ξ£\Sigma. Within the class of Filippov solutions, if Ξ£\Sigma is attractive, one should expect solution trajectories to slide on Ξ£\Sigma. It is well known, however, that the classical Filippov convexification methodology is ambiguous on Ξ£\Sigma. The situation is further complicated by the possibility that, regardless of how sliding on Ξ£\Sigma is taking place, during sliding motion a trajectory encounters so-called generic first order exit points, where Ξ£\Sigma ceases to be attractive. In this work, we attempt to understand what behavior one should expect of a solution trajectory near Ξ£\Sigma when Ξ£\Sigma is attractive, what to expect when Ξ£\Sigma ceases to be attractive (at least, at generic exit points), and finally we also contrast and compare the behavior of some regularizations proposed in the literature. Through analysis and experiments we will confirm some known facts, and provide some important insight: (i) when Ξ£\Sigma is attractive, a solution trajectory indeed does remain near Ξ£\Sigma, viz. sliding on Ξ£\Sigma is an appropriate idealization (of course, in general, one cannot predict which sliding vector field should be selected); (ii) when Ξ£\Sigma loses attractivity (at first order exit conditions), a typical solution trajectory leaves a neighborhood of Ξ£\Sigma; (iii) there is no obvious way to regularize the system so that the regularized trajectory will remain near Ξ£\Sigma as long as Ξ£\Sigma is attractive, and so that it will be leaving (a neighborhood of) Ξ£\Sigma when Ξ£\Sigma looses attractivity. We reach the above conclusions by considering exclusively the given piecewise smooth system, without superimposing any assumption on what kind of dynamics near Ξ£\Sigma (or sliding motion on Ξ£\Sigma) should have been taking place.Comment: 19 figure

    k-core organization of complex networks

    Full text link
    We analytically describe the architecture of randomly damaged uncorrelated networks as a set of successively enclosed substructures -- k-cores. The k-core is the largest subgraph where vertices have at least k interconnections. We find the structure of k-cores, their sizes, and their birth points -- the bootstrap percolation thresholds. We show that in networks with a finite mean number z_2 of the second-nearest neighbors, the emergence of a k-core is a hybrid phase transition. In contrast, if z_2 diverges, the networks contain an infinite sequence of k-cores which are ultra-robust against random damage.Comment: 5 pages, 3 figure

    Π€ΠžΠ ΠœΠ˜Π ΠžΠ’ΠΠΠ˜Π• Π’Π Π•Π₯ΠœΠ•Π ΠΠ«Π₯ БВРУКВУР Π’ ΠŸΠžΠ”Π›ΠžΠ–ΠšΠΠ₯ ΠšΠΠ Π‘Π˜Π”Π ΠšΠ Π•ΠœΠΠ˜Π― ΠŸΠ›ΠΠ—ΠœΠžΠ₯Π˜ΠœΠ˜Π§Π•Π‘ΠšΠ˜Πœ Π’Π ΠΠ’Π›Π•ΠΠ˜Π•Πœ

    Get PDF
    This article is a review of the technology for the formation of threeβˆ’dimensional structures in silicon carbide substrates. The technological solution of these problems ionβˆ’stimulation plasmochemistry etching in its various modifications, the most successful being by ICP sources (sources of inductively coupled plasma).Silicon carbide consists of silicon and carbon which produce volatile fluorides in reaction with fluorine. Therefore for plasmochemistry etching of silicon carbide one uses fluorineβˆ’containing gases, most often sulfur hexafluoride (SF6), and sometimes with additions of oxygen and argon. During plasmochemistry etching of silicon carbide oneΒ  uses theΒ  maskΒ  theΒ  materialΒ  of which does not interact with fluorine.Β  As a rule these are thin films of metals, e.g.Β  Cu, Al and Ni, and sometimes films of silicon oxides.The mostΒ  important technological trend of this process is making through holesΒ  by etching of SiC substrates with GaN epitaxial layers, and their subsequent metallization.In this review we will present examples of ICP source applications for the formation of microβˆ’ and nanoβˆ’sized threeβˆ’dimensional structures in silicon carbide substrates, includingΒ  makingΒ  through holesΒ  in SiC substrates with GaN epitaxial layers.ΠŸΡ€Π΅Π΄ΡΡ‚Π°Π²Π»Π΅Π½ ΠΎΠ±Π·ΠΎΡ€, посвящСнный Ρ‚Π΅Ρ…Π½ΠΎΠ»ΠΎΠ³ΠΈΠΈ формирования Ρ‚Ρ€Π΅Ρ…ΠΌΠ΅Ρ€Π½Ρ‹Ρ… структур Π² ΠΏΠΎΠ΄Π»ΠΎΠΆΠΊΠ°Ρ…Β  ΠΊΠ°Ρ€Π±ΠΈΠ΄Π° крСмния. ВСхнологичСски эта Π·Π°Π΄Π°Ρ‡Π° Ρ€Π΅ΡˆΠ°Π΅Ρ‚ΡΡ ΠΈΠΎΠ½Π½ΠΎβˆ’ΡΡ‚ΠΈΠΌΡƒΠ»ΠΈΡ€ΠΎΠ²Π°Π½Π½Ρ‹ΠΌ ΠΏΠ»Π°Π·ΠΌΠΎ-химичСским Ρ‚Ρ€Π°Π²Π»Π΅Π½ΠΈΠ΅ΠΌ Π² Ρ€Π°Π·Π»ΠΈΡ‡Π½Ρ‹Ρ… Π΅Π³ΠΎ вариациях, ΠΈ Π½Π°ΠΈΠ±ΠΎΠ»Π΅Π΅ ΡƒΡΠΏΠ΅ΡˆΠ½ΠΎ β€” с ΠΏΠΎΠΌΠΎΡ‰ΡŒΡŽ источника с ΠΈΠ½Π΄ΡƒΠΊΡ‚ΠΈΠ²Π½ΠΎ связанной ΠΏΠ»Π°Π·ΠΌΠΎΠΉ (ICP).ΠšΠ°Ρ€Π±ΠΈΠ΄Β  крСмния состоит ΠΈΠ· крСмния ΠΈ ΡƒΠ³Π»Π΅Ρ€ΠΎΠ΄Π°, ΠΊΠΎΡ‚ΠΎΡ€Ρ‹Π΅ Π² Ρ€Π΅Π°ΠΊΡ†ΠΈΠΈ со Ρ„Ρ‚ΠΎΡ€ΠΎΠΌ ΠΎΠ±Ρ€Π°Π·ΡƒΡŽΡ‚ Π»Π΅Ρ‚ΡƒΡ‡ΠΈΠ΅ Ρ„Ρ‚ΠΎΡ€ΠΈΠ΄Ρ‹. РСакция травлСния ΠΈΠ΄Π΅Ρ‚ ΠΏΡ€ΠΈ взаимодСйствии крСмния ΠΈ ΡƒΠ³Π»Π΅Ρ€ΠΎΠ΄Π° с Π°ΠΊΡ‚ΠΈΠ²Π½Ρ‹ΠΌΠΈ Ρ€Π°Π΄ΠΈΠΊΠ°Π»Π°ΠΌΠΈ ΠΈ ΠΈΠΎΠ½Π°ΠΌΠΈ Ρ„Ρ‚ΠΎΡ€Π°. ΠŸΠΎΡΡ‚ΠΎΠΌΡƒ для плазмохимичСского травлСния ΠΊΠ°Ρ€Π±ΠΈΠ΄Π° крСмния ΠΈΡΠΏΠΎΠ»ΡŒΠ·ΡƒΡŽΡ‚ фторсодСрТащий Π³Π°Π·, Π² Π±ΠΎΠ»ΡŒΡˆΠΈΠ½ΡΡ‚Π²Π΅ случаСв β€” ΡˆΠ΅ΡΡ‚ΠΈΡ„Ρ‚ΠΎΡ€ΠΈΡΡ‚ΡƒΡŽ сСру SF6 (часто с Π΄ΠΎΠ±Π°Π²ΠΊΠΎΠΉ кислорода ΠΈ ΠΈΠ½ΠΎΠ³Π΄Π°Β  Π°Ρ€Π³ΠΎΠ½Π°). Π’ качСствС масок ΠΏΡ€ΠΈ плазмохимичСском Ρ‚Ρ€Π°Π²Π»Π΅Π½ΠΈΠΈ ΠΊΠ°Ρ€Π±ΠΈΠ΄Π° крСмния ΠΏΡ€ΠΈΠΌΠ΅Π½ΡΡŽΡ‚Β  ΠΌΠ°Ρ‚Π΅Ρ€ΠΈΠ°Π»Ρ‹, Π½Π΅ Π²Π·Π°ΠΈΠΌΠΎΠ΄Π΅ΠΉΡΡ‚Π²ΡƒΡŽΡ‰ΠΈΠ΅ с Ρ„Ρ‚ΠΎΡ€ΠΎΠΌ. ΠŸΡ€Π΅ΠΈΠΌΡƒΡ‰Π΅ΡΡ‚Π²Π΅Π½Π½ΠΎ это ΠΏΠ»Π΅Π½ΠΊΠΈ ΠΌΠ΅Ρ‚Π°Π»Π»ΠΎΠ² Cu, Al ΠΈ Ni, Ρ€Π΅ΠΆΠ΅ β€” ΠΏΠ»Π΅Π½ΠΊΠΈ оксида крСмния.Особо  Π²Π°ΠΆΠ½ΠΎΠ΅ тСхнологичСскоС Π½Π°ΠΏΡ€Π°Π²Π»Π΅Π½ΠΈΠ΅, связанноС с плазмохимичСским Ρ‚Ρ€Π°Π²Π»Π΅Π½ΠΈΠ΅ΠΌ ΠΏΠΎΠ΄Π»ΠΎΠΆΠ΅ΠΊ SiC с нанСсСнными Π½Π° Π½ΠΈΡ… ΡΠΏΠΈΡ‚Π°ΠΊΡΠΈΠ°Π»ΡŒΠ½Ρ‹ΠΌΠΈ слоями GaN, β€” это ΠΏΠΎΠ»ΡƒΡ‡Π΅Π½ΠΈΠ΅ Π² Π½ΠΈΡ… сквозных  отвСрстий ΠΈ ΠΈΡ… ΠΏΠΎΡΠ»Π΅Π΄ΡƒΡŽΡ‰Π°Ρ мСталлизация.ΠŸΡ€ΠΈΠ²Π΅Π΄Π΅Π½Ρ‹ ΠΏΡ€ΠΈΠΌΠ΅Ρ€Ρ‹ использования источников ICP для формирования Ρ‚Ρ€Π΅Ρ…ΠΌΠ΅Ρ€Π½Ρ‹Ρ… структур с ΠΌΠΈΠΊΡ€ΠΎβˆ’ ΠΈ Π½Π°Π½ΠΎΡ€Π°Π·ΠΌΠ΅Ρ€Π°ΠΌΠΈ Π² ΠΊΠ°Ρ€Π±ΠΈΠ΄Π΅ крСмния.Π’ Ρ‚ΠΎΠΌ числС рассмотрСно Ρ„ΠΎΡ€ΠΌΠΈΡ€ΠΎΠ²Π°Π½ΠΈΠ΅ сквозных  отвСрстий Π² ΠΏΠΎΠ΄Π»ΠΎΠΆΠΊΠ°Ρ… ΠΊΠ°Ρ€Π±ΠΈΠ΄Π° крСмния с ΡΠΏΠΈΡ‚Π°ΠΊΡΠΈΠ°Π»ΡŒΠ½Ρ‹ΠΌΠΈ слоями Π½ΠΈΡ‚Ρ€ΠΈΠ΄Π° галлия
    • …
    corecore