21 research outputs found

    Neue Sensorsysteme mit optischer Signalverarbeitung. Teilprojekt: 3D-Technologieentwicklung fuer augenaehnliche CMOS-Bildaufnehmer Abschlussbericht

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    A process for the fabrication of stacked image sensors with single crystalline silicon photodiodes vertically integrated with CMOS readout circuitry has been developed. New process steps such as aligned water bonding, fabrication of photodiodes in bonded silicon layers and vertical interconnects using doped polysilicon have been demonstrated. Compatibility to standard CMOS technology is a general feature of all process developments. HDRC-color image sensors have been fabricated using color resist layers. (orig.)SIGLEAvailable from TIB Hannover: F99B1148+a / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekBundesministerium fuer Bildung, Wissenschaft, Forschung und Technologie, Bonn (Germany)DEGerman
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