1 research outputs found
Unconventional applications of wire bonding create opportunities for microsystem integration
- Author
- A C Fischer
- Antelius M
- Antelius M
- Antelius M
- Antelius M
- Badilita V
- Badilita V
- Badilita V
- Badilita V
- Badilita V
- Baron J
- Beams J W
- Bischoff A
- Calpito D
- Cauchois R
- Cepnik C
- Chen Q
- Chen S-J
- Chylak B
- Clark C
- Coucoulas A
- F Niklaus
- Fischer A C
- Fischer A C
- Fischer A C
- Fraunhofer
- G Stemme
- Gradin H
- Greig W J
- Gruschke O
- Haberer W Schuttler M H B
- Harkness S
- Harman G G
- Hembree D R
- Hembree D R
- Hembree D R
- Hirshberg A
- Hirshberg A
- Iwata R T
- J G Korvink
- Kai L J
- Khandros I Y
- Kim D
- Kim T W
- Kratt K
- Kratt K
- Kung H
- Levine L
- Liao Y-T
- Liao Y-T
- Lim Y-K
- Lin K-Y
- Lo Y-L Ho T-L Chen J-L Wu S-L
- Lu J
- Lyn R
- Lyn R
- Mack B
- McTaggart V
- Moazenzadeh A
- N Roxhed
- Ndip I
- Ng B
- Olver K A
- Prasad S K
- Qin W
- Sadeghi M
- Sameoto D
- Saraswati T
- Schmitz S Oppermann H Schröder H Reichl H
- Schröder S
- Schröder S
- Schuettler M
- Tan Y
- Tan Y C
- Tay A A O
- Texas Instruments Incorporated
- Thiede H P
- Thuerlemann S
- Tonomura W
- Tsutsumi Y
- U Wallrabe
- Varanasi N
- Villar G
- Vischer D
- Wang J J
- Wheeler H
- Willmot R
- Wood A G
- Yabuki R Tea N
- Yan J-B
- Publication venue
- 'IOP Publishing'
- Publication date
- Field of study