Leakage Current Mechanisms in SiGe HBTs Fabricated Using Selective and Nonselective Epitaxy

SiGe heterojunction bipolar transistors (HTBs) have been fabricated using selective epitaxy for the Si collector, followed in the same growth step by nonselective epitaxy for the p+ SiGe base and n-Si emitter cap. DC electrical characteristics are compared with cross-section TEM images to identify the mechanisms and origins of leakage currents associated with the epitaxy in two different types of transistor . In the first type, the polysilicon emitter is smaller than the collector active area, so that the extrinsic base implant penetrates into the single-crystal Si and SiGe around the perimeter of the emitter and the polycrystalline Si and SiGe exrtrinsic base. In these transistors, the Bummel plots are near-ideal and there is no evidence of emitter/collector leakage. In the second type, the collector active area is smaller than the polysilicon emitter, so the extrinsic base implant only penetrates into the polysilicon extrinsic base. In these transistors, the leakage currents observed depend on the base doping level. In transistors with a low doped base, emitter/collector and emitter/base leakage is observed, whereas in transistors with a high doped base only emitter/base leakage is observed. The emitter/collector leakage is explained by punch through o fhte base caused by thinning of the SiGe base at the emitter perimeter. The emitter/base leakeage is shown to be due to Poole-Frenkel mechanism and is explained by penetration of the emitter/base depletion region into the p+ polysilicon extrinsic base at the emitter periphery. Variable collector/base reverse leakage currents are observed and a variety of mechanisms are observed, including Shockley-Read-Hall recombination, trap assisted tunneling, Poole Frenkel and band to band tunneling. These result s are explained by the presence of polysilicon grains on the sidewalls of the field oxide at the collector perimeter

Leakage current mechanisms associated with selective epitaxy in SiGe heterojunction bipolar transistors

SiGe Heterojunction Bipolar Transistors (HBT's) have been fabricated using selective epitaxy for the Si collector, followed in the same growth step by non-selective epitaxy for the SiGe base and Si emitter cap. E/B leakage currents are compared with cross section TEM images to identify sources of leakage currents associated with the epitaxy. In addition, the influence of the position of the extrinsic base implant with respect to the polysilicon emitter on the leakage currents is studied. The emitter/base leakage currents are modelled using Shockley-Read-Hall recombination, trap-assisted tunnelling and Poole-Frenkel generation. The position of the extrinsic base implant is shown to have a strong influence on the leakage currents. The Poole-Frenkel effect dominates the emitter/base leakage current in transistors in which the collector area is smaller than the polysilicon emitter. This result is explained by penetration of the emitter/base depletion region into the p+ polysilicon extrinsic base at the perimeter of the emitter. These leakage currents are eliminated when the collector area is increased so that the extrinsic base implant penetrates into the single-crystal silicon at the perimeter of the emitter