Influence of attractive van der Waals interactions on the optimal excitations in thermocapillary-driven spreading

Recent investigations of microfluidic flows have focused on manipulating the motion of very thin liquid films by modulating the surface tension through an applied streamwise temperature gradient. The extent to which the choice of contact line model affects the flow and stability of such thermocapillary-driven films is not completely understood. Regardless of the contact line model used, the linearized disturbance operator corresponding to the evolution of the film height is non-normal, and a generalized non-modal stability analysis is required. Surprisingly, early predictions of frontal instability that stemmed from conventional modal analysis of thermocapillary flow on a flat, infinite precursor film showed excellent agreement with experiment. Within the more rigorous framework provided by a generalized stability analysis, this work investigates the transient dynamics and amplification of optimal disturbances subject to a finite precursor film generated by attractive van der Waals forces. Convergence of the disturbance growth rates and perturbed shapes to the asymptotic solutions obtained by conventional linear stability analysis occurs early in the spreading process. In addition, the level of transient disturbance amplification is minimal. The equations governing thermocapillary-driven spreading exhibit a small degree of non-normality, which explains the source of agreement between modal theory and experiment. The more rigorous generalized stability analysis presented here, however, affords critical insight into the types of disturbances leading to maximum unstable growth and the exact influence of the contact line model used

Influence of boundary slip on the optimal excitations in thermocapillary driven spreading

Thin liquid films driven to spread on homogeneous surfaces by thermocapillarity can undergo frontal breakup and parallel rivulet formation with well-defined wavelength. Previous modal analyses have relieved the well-known divergence in stress that occurs at a moving contact line by matching the front region to a precursor film. Because the linearized disturbance operator is non-normal, a generalized, nonmodal analysis is required to probe film stability at all times. The effect of the contact line model on nonmodal stability has not been previously investigated. This work examines the influence of boundary slip on thermocapillary driven spreading using a transient stability analysis, which recovers the conventional modal results in the long-time limit. In combination with earlier work on thermocapillary driven spreading, this study verifies that the dynamics and stability of this system are rather insensitive to the choice of contact line model and that the leading eigenvalue is physically determinant, thereby assuring results that agree with the eigenspectrum. Modal results for the flat precursor film model are reproduced with appropriate choice of slip coefficient and contact line slope

On a generalized approach to the linear stability of spatially nonuniform thin film flows

The presence of a deformable free surface in thin films driven to spread by body or shear forces gives rise to base states that are spatially nonuniform. This nonuniformity produces linearized disturbance operators that are non-normal and an eigenvalue spectrum that does not necessarily predict stability behavior. The falling film provides a simple example for demonstrating a more generalized, rigorous nonmodal approach to linear stability for free surface flows. Calculations of the pseudospectra and maximum disturbance amplification in this system, however, reveal weak effects of non-normality and transient growth such that the modal growth rate is rapidly recovered. Subdominant modes contribute little energy to the leading eigenvector because the oscillatory behavior is rapidly damped by surface tension. Generalization of these results to numerous other lubrication flows involving surface tension suggests similarly weak non-normality and transient growth

“Is Sarah a Bully or a Friend?”: Examining Students’ Text-based Written Expressions of Bullying

Bullying has been recognized as a complex phenomenon with potential for serious negative outcomes. Activities that address complex social situations of bullying, such as reading and writing to a pen pal about fictional literature, provide space for students to think and share about personal issues that they encounter and how characters deal with similar issues in productive ways. For this research, we used a critical literacy lens to explore bullying within the context of language, power and context. This research shares qualitative analysis of letters students wrote to adult pen pals after reading a fictional book with a plot addressing bullying. Letters from 32 students were analyzed and four themes emerged: 1) text-based interpretations about bullying; 2) personal experiences and perspectives about bullying; 3) bullying in relation to friendship and social positioning; and 4) lessons learned for addressing bullying via action and advocacy

Squeezed K^+ K^- correlations in high energy heavy ion collisions

The hot and dense medium formed in high energy heavy ion collisions may modify some hadronic properties. In particular, if hadron masses are shifted in-medium, it was demonstrated that this could lead to back-to-back squeezed correlations (BBC) of particle-antiparticle pairs. Although well-established theoretically, the squeezed correlations have not yet been discovered experimentally. A method has been suggested for the empirical search of this effect, which was previously illustrated for phi-phi pairs. We apply here the formalism and the suggested method to the case of K^+ K^- pairs, since they may be easier to identify experimentally. The time distribution of the emission process plays a crucial role in the survival of the BBC's. We analyze the cases where the emission is supposed to occur suddenly or via a Lorentzian distribution, and compare with the case of a Levy distribution in time. Effects of squeezing on the correlation function of identical particles are also analyzed.Comment: 9 pages and 6 figures (figures 2 to 6 contain 4 plots each). Paragraph added to text, figures 2 to 6 revised for improving visualizatio

Learning for design reuse

Over the past decade 'design assistance', i.e. where the computer is viewed as an Intelligent Design Assistant (IDA) [MacCallum-etal85], has emerged in knowledge based design support and has formed the basic research strategy for the CAD Centre, University of Strathclyde, since the mid-80s. Within this philosophy, an IDA would act as a colleague to a designer, providing guidance, learning from past design experiences, carrying out semi and fully automated tasks, explaining its reasoning and in essence complementing the designer's own natural skills, and thus leaving the ultimate decision making, control and responsibility with the designer

Direct printing of polymer microstructures on flat and spherical surfaces using a letterpress technique

We have developed a letterpress technique capable of printing polymer films with micrometer scale feature sizes onto flat or spherically shaped nonporous substrates. This printing technique deposits polymer only in desired regions thereby eliminating subsequent developing and subtraction steps. Flat or curved printing plates, which are fabricated from either rigid or deformable materials, are used to transfer thin molten polymer films onto flat target substrates. By deforming the printing plates into a spherical shape, it is also possible to print patterned films onto the concave side of a spherically deformed target substrate. These printed films serve as good resists for both wet chemical etching and reactive ion etching. Interferometric measurements of the polymer film thickness are used to probe physical mechanisms affecting printing instabilities, pattern fidelity, and edge resolution. Our experimental study indicates that this letterpress technique may prove suitable for high-throughput device fabrication involving large-area microelectronics