Characterization of crystalline silicon based on measurements of the photoluminescence emission

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Impact of iron on the room temperature luminescence efficiency of oxygen-containing precipitates in silicon

Oxygen precipitation in silicon has been associated with a weak room temperature sub-bandgap luminescence emission at around 1600 nm. We show that the additional presence of iron impurities enhances this emission by an order of magnitude and results in a red shift of the peak luminescence by approximately 45 nm. We not only observe an increase in the luminescence emission with iron contamination level but also with the density and size of the oxide precipitates. Moreover, we provide evidence that the sub-bandgap luminescence emission increases proportionally with the concentration of iron segregated to oxide precipitates after high temperature (>700 °C) annealing and thus allows evaluation of the gettering efficiency of oxygen-containing precipitates. Annealing of iron-contaminated samples at low temperatures (550 °C) results in a considerable reduction in the interstitial iron concentration without changing the sub-bandgap luminescence, indicating that the sink to which iron diffuses depends upon temperature

Understanding the Light-induced Lifetime Degradation and Regeneration in Multicrystalline Silicon

In this contribution, we focus on improving the fundamental understanding of the carrier lifetime degradation and regeneration observed in block-cast multicrystalline silicon (mc-Si) wafers under illumination at elevated temperature. We observe a pronounced degradation in lifetime at 1 sun light intensity and 75̊C after rapid thermal annealing (RTA) in a belt-firing furnace at a set peak temperature of 900̊C. However, almost no lifetime instability is detected in mc-Si wafers which are fired at a peak temperature of only 650̊C, clearly showing that the firing step is triggering the degradation effect. Lifetime spectroscopy reveals that the light-induced recombination centre is a deep-level centre with an asymmetric electron-to-hole capture cross section ratio of 20±7. After completion of the degradation, the lifetime is observed to recover and finally reaches even higher carrier lifetimes compared to the initial state. While the lifetime degradation is found to be homogeneous, the regeneration shows an inhomogeneous behaviour, which starts locally and spreads later laterally throughout the sample. Furthermore, the regeneration process is extremely slow with time constants of several hundred hours. We demonstrate, however, that by increasing the regeneration temperature, it is possible to significantly speed up the regeneration process so that it might become compatible with industrial solar cell production. To explain the observed lifetime evolution, we propose a defect model, where metal precipitates in the mc-Si bulk dissolve during the RTA treatment and the mobile metal atoms bind to a homogeneously distributed impurity. Restructuring and subsequent dissociation of this defect complex is assumed to cause the lifetime degradation, whereas a subsequent diffusion of the mobile species to the sample surfaces and crystallographic defects explains the regeneration.State of Lower SaxonyGerman Federal Ministry of Economics/0325763

Dynamic photoluminescence lifetime imaging for injectiondependent lifetime measurements

We investigate the impact of an injection-dependent carrier lifetime in crystalline silicon on dynamic photoluminescence lifetime imaging (dynamic PLI). Although the dynamic lifetime approach is a technique that evaluates the time-dependence of a quantity proportional to the excess carrier density, it is only weakly influenced by the injection-level dependence of the lifetime. The reason for the little impact is the fact that the evaluation of dynamic PLI measurements does not only involve the decay of the carrier density, as it is common for photoconductance decay measurements, but also the increase of the carrier density directly after switching on the excitation source. In this contribution, we present injection-dependent lifetime measurements that are acquired with the camera-based dynamic PLI technique. We find that the deviation of the actual steady-state carrier lifetime from the lifetime obtained with dynamic PLI is less than 20 % for a wide range of measurement conditions.State of Lower SaxonyGerman Federal Ministry for the Environment, Nature Conservation, and Nuclear Safet

Experimental setup for camera-based measurements of electrically and optically stimulated luminescence of silicon solar cells and wafers

We report in detail on the luminescence imaging setup developed within the last years in our laboratory. In this setup, the luminescence emission of silicon solar cells or silicon wafers is analyzed quantitatively. Charge carriers are excited electrically (electroluminescence) using a power supply for carrier injection or optically (photoluminescence) using a laser as illumination source. The luminescence emission arising from the radiative recombination of the stimulated charge carriers is measured spatially resolved using a camera. We give details of the various components including cameras, optical filters for electro- and photo-luminescence, the semiconductor laser and the four-quadrant power supply. We compare a silicon charged-coupled device (CCD) camera with a back-illuminated silicon CCD camera comprising an electron multiplier gain and a complementary metal oxide semiconductor indium gallium arsenide camera. For the detection of the luminescence emission of silicon we analyze the dominant noise sources along with the signal-to-noise ratio of all three cameras at different operation conditions. © 2011 American Institute of Physics

Data for Impact of iron on the room temperature luminescence efficiency of oxygen-containing precipitates in silicon

Oxygen precipitation in silicon has been associated with a weak room temperature sub-bandgap luminescence emission at around 1600 nm. We show that the additional presence of iron impurities enhances this emission by an order of magnitude and results in a red shift of the peak luminescence by approximately 45 nm. We not only observe an increase in the luminescence emission with iron contamination level but also with the density and size of the oxide precipitates. Moreover, we provide evidence that the sub-bandgap luminescence emission increases proportionally with the concentration of iron segregated to oxide precipitates after high temperature (>700 °C) annealing and thus allows evaluation of the gettering efficiency of oxygen-containing precipitates. Annealing of iron-contaminated samples at low temperatures (550 °C) results in a considerable reduction in the interstitial iron concentration without changing the sub-bandgap luminescence, indicating that the sink to which iron diffuses depends upon temperature

Imaging of the interstitial iron concentration in crystalline silicon by measuring the dissociation rate of iron-boron pairs

We present a dynamic approach for measuring the interstitial iron concentration in boron-doped crystalline silicon using photoluminescence (PL) imaging. This camera-based technique utilizes the characteristic dependence of the dissociation rate of iron-boron pairs on the interstitial iron concentration. We determine the dissociation rate by measuring the time-dependent PL signal after complete association of iron-boron pairs in the sample. Since we are only interested in the time dependence of the PL signal, we are able to generate images of the interstitial iron concentration in absolute units without any calibration and without knowing the recombination properties of the interstitial iron or iron-boron pairs

Lifetime degradation and regeneration in multicrystalline silicon under illumination at elevated temperature

We examine the carrier lifetime evolution of block-cast multicrystalline silicon (mc-Si) wafers under illumination (100 mW/cm2) at elevated temperature (75°C). Samples are treated with different process steps typically applied in industrial solar cell production. We observe a pronounced degradation in lifetime after rapid thermal annealing (RTA) at 900°C. However, we detect only a weak lifetime instability in mc-Si wafers which are RTA-treated at 650°C. After completion of the degradation, the lifetime is observed to recover and finally reaches carrier lifetimes comparable to the initial state. To explain the observed lifetime evolution, we suggest a defect model, where metal precipitates in the mc-Si bulk dissolve during the RTA treatment