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9 research outputs found
Influence of kaolin geopolymer ceramic additions to the wettability and electrical properties of Sn-3.0Ag-0.5Cu (SAC305) lead free solder
Author
Marliza Mostapha
Mohd Arif Anuar Mohd Salleh
+13 more
Mohd Mustafa Al Bakri Abdullah
Nogita K.
Nogita K.
Nur Syahirah Mohamad Zaimi
Ramli M.I.I.
Romisuhani Ahmad
Said R.M.
Salleh M.A.A.M.
Salleh M.A.A.M.
Salleh M.A.A.M.
Salleh M.A.A.M.
Somidin F.
Zaimi N.
Publication venue
'IOP Publishing'
Publication date
Field of study
No full text
Crossref
Enhanced thermal and microstructure properties of Sn-1.0Ag-0.7Cu based lead-free solder with Titanium Oxide addition
Author
Mohd Arif Anuar Mohd Salleh
Mohd Izrul Izwan Ramli
+14 more
Mohd Nazree Derman
Nogita K.
Nogita K.
Norainiza Saud
Norhayanti Mohd Nasir
Ramli M.I.I.
Rita Mohd Said
Said R.M.
Salleh M.A.A.M.
Salleh M.A.A.M.
Salleh M.A.A.M.
Salleh M.A.A.M.
Saud N.
Somidin F.
Publication venue
'IOP Publishing'
Publication date
Field of study
No full text
Crossref
Effects of Gallium addition on the thermal properties and whiskers growth under electrical current stressing
Author
Aimi Noorliyana Hashim
Condra L. W.
+17 more
Mohd Arif Anuar Mohd Salleh
Mokhtar N. M.
Nasir N.M.
Nogita K.
Nogita K.
Noor Zaimah Mohd Mokhtar
Ramli M.I.I.
Said R.M.
Salleh M.A.A.M.
Salleh M.A.A.M.
Salleh M.A.A.M.
Salleh M.A.A.M.
Somidin F.
Sufian Firdaus Nazri
Sun M.
Yao Z. X.
Zaimah N.
Publication venue
'IOP Publishing'
Publication date
Field of study
No full text
Crossref
Effect of rare-element (Ga) addition on the microstructure and mechanical properties of Sn-0.7Cu and Sn-0.7Cu-0.05Ni lead-free solder alloys
Author
Bhattacharya S.
+21 more
Caul H.J.
Chen K.I.
Cheng
Eng. A 633-637
Gao L.L.
Hsuan T.C.
Klein Wassink R.J.
Liu N.S.
Mohd Arif Anuar Mohd Salleh
Mohd Salleh M. A. A.
Nogita K.
Nogita K.
Ramli M.I.I.
Said R.M.
Salleh M. A. A. M.
Salleh M.A.A.M.
Salleh M.A.A.M.
Salleh M.A.A.M.
Salleh M.A.A.M.
Somidin F.
Sufian Firdaus Nazri
Publication venue
'IOP Publishing'
Publication date
Field of study
No full text
Crossref
Effect of surface finish on the wettability and electrical resistivity of Sn-3.0Ag-0.5Cu solder
Author
Jung D. H.
Jung D. H.
+18 more
Juyana A. Wahab
Mohd Amin N. A. A.
Mohd Arif Anuar Mohd Salleh
Mohd Izrul Izwan Ramli
Mohd Salleh M. A. A.
Nogita K.
Nogita K.
Nurul Razliana Abdul Razak
Ramli M.I.I.
Ramli M.I.I.
Rita. Mohd Said
Said R.M.
Salleh M.A.A.M.
Salleh M.A.A.M.
Salleh M.A.A.M.
Siti Farahnabilah Muhd Amli
Somidin F.
Sun L.
Publication venue
'IOP Publishing'
Publication date
Field of study
No full text
Crossref
Characterization of geopolymer ceramic reinforced Sn-0.7Cu composite solder: Effect of milling time and speed.
Author
Allemang R.
Azimi E.A
+21 more
Aziz I. H.
Davidovits J
Dorey R.A
Indexed S.
Maiteli Thiaghu
Marliza Mostapha
Mohd Arif Anuar Mohd Salleh
Mohd Mustafa Al Bakri Abdullah
Nasir N.M.
Nogita K.
Nogita K.
Nur Syahirah Mohamad Zaimi
Ramli M.I.I.
Ramli M.I.I.
Rao J.
Romisuhani Ahmad
Salleh M.A.A.M.
Salleh M.A.A.M.
Salleh M.A.A.M.
Somidin F.
Zhang P
Publication venue
'IOP Publishing'
Publication date
Field of study
No full text
Crossref
Tin (Sn) whisker growth from electroplated Sn finished
Author
Aimi Noorliyana Hashim
Ashworth M.A.
+22 more
Boettinger W.J.
Chason E.
Fukuda Y.
Jadhav N.
Jiang B.
Kim K.S.
Lin C.-K.
Mohd Arif Anuar Mohd Salleh
Nasir N.M.
Nogita K.
Nogita K.
Noor Zaimah Mohd Mokhtar
Noorliyana Hashim A.
Ramli M.I.I.
Ramli M.I.I.
Salleh M.A.A.M.
Salleh M.A.A.M.
Salleh M.A.A.M.
Shahida Idris
Skwarek A.
Somidin F.
Zaimah Mohd Mokhtar N.
Publication venue
'IOP Publishing'
Publication date
Field of study
No full text
Crossref
Thermal behaviour and microstructural analysis of Sn-0.7Cu alloy and Sn-0.7Cu soldered on electroless nickel/immersion gold
Author
Ai Ling Teoh
Chen W.-T.
+27 more
Cho M.G.
Dewi Suriyani Che Halin
El-Daly A.
El-Daly A.
El-Rehim A.A.
Elmer J.W.
Fazal M.
Jaffery H.A.
Juyana A. Wahab
Kai Loong Foo
Lu T.
Mohd Arif Anuar Mohd Salleh
Nasir N.M.
Nogita K.
Ramli M.I.I.
Ramli M.I.I.
Salleh M.A.A.M.
Salleh M.A.A.M.
Salleh M.A.A.M.
Salleh M.M.
Sayyadi R.
Shang H.
Silva B.L.
Somidin F.
Tu X.
Ventura T.
Zeng G.
Publication venue
'IOP Publishing'
Publication date
Field of study
No full text
Crossref
The effect of Aluminium addition on the microstructure of lead-free solder alloys: A short review
Author
Abdelhadi O.M.
Cheng S.
+34 more
Chi Ying Tan
Cho M.G.
Desmarest S.G.
Dong W.
El-Daly A.
El-Daly A.
Huang H.-Y.
Kanlayasiri K.
Kantarcıoğlu A.
Kotadia H.R.
Lee Tae-Kyu
Leong Y.M.
Li L.
Maslinda K.
Mohd Arif Anuar Mohd Salleh
Nadhirah M.N.
Nogita K.
Nogita K.
Plevachuk Y.
Ramli M.I.I.
Ramli M.I.I.
Ramli M.I.I.
Sabri M.F.M.
Sabri M.F.M.
Said R.M.
Salleh M.A.A.M.
Salleh M.A.A.M.
Salleh M.A.A.M.
Somidin F.
Tan X.F.
Tao Q.
Tu X.
Yang L.
Zhang Q.K.
Publication venue
'IOP Publishing'
Publication date
Field of study
No full text
Crossref