1 research outputs found
Packaging and Reliability Issues in Micro/Nano Systems
- Author
- A Cao
- A Grisel
- A Hanneborg
- A Singh
- AL Tiensuu
- AM Leung
- AP Lee
- AS Laskar
- AV Chavan
- B Ziaie
- C Luo
- CH Hsu
- CH Mastrangelo
- D Bystrom
- D Hicks
- D Routkevitch
- DR Spark
- DW Lee
- EE Lewis
- EH Klaassen
- F Arias
- F Niklaus
- F Rosebury
- G Thyrum
- G Wallis
- GP Peterson
- GT Mulhern
- H Guckel
- H Henmi
- H Reichl
- H Scholze
- H Takagi
- J Berstein
- J Gou
- J Lau
- JB Kim
- JH Partridge
- JH Tsai
- JH Tsai
- JJ Sniegowski
- JK Bhardway
- JL Lund
- JT Butler
- K Ikeda
- K Velikov
- KE Peterson
- L Bowman
- L Jiang
- L Lin
- L Lin
- L Lin
- L Muller
- M Bartek
- M Chiao
- M Chiao
- M Chiao
- M Chiao
- M Dokmeci
- M Esashi
- M Esashi
- M Esashi
- M Madou
- M Putty
- M Schwartz
- M Shimbo
- MB Cohn
- MC Wu
- ME Poplawski
- MG Nicholas
- MJ Zdeblick
- MK Keshavan
- MM Maharbiz
- P Kapur
- P Kumar
- PM Zavracky
- Q-Y Tong
- R Aigner
- R Lengtenberg
- R Prasad
- R Reichl
- RC Benson
- RL Smith
- RR Tummala
- RR Tummala
- RW Bower
- S Groen Van der
- S Savastiouk
- S Shoji
- S Wolf
- SA Audet
- SD Senturia
- SF Trautweiler
- SJ Ok
- SUS Choi
- T Akin
- T Hara
- WC Tang
- WD Brown
- WH Ko
- Y Lee
- YC Su
- YC Tai
- YT Cheng
- YT Cheng
- YT Cheng
- Publication venue
- 'Springer Science and Business Media LLC'
- Publication date
- 01/01/2007
- Field of study
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